Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA

Saved in:
Bibliographic Details
Corporate Author International Thermal Conductivity Conference Logan, Utah
Other Authors Ban, Heng (Editor)
Format Electronic eBook
LanguageEnglish
Published Lancaster, PA : DEStech Publications, 2018.
Subjects
Heat > Conduction > Congresses.
Heat > Conduction > Measurement > Methodology > Congresses.
Materials > Thermal properties > Congresses.
Materials > Thermal properties > Measurement > Methodology > Congresses.
Expansion (Heat) > Congresses.
Expansion (Heat) > Measurement > Methodology > Congresses.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781523153800
1523153806
9781605955353
1605955353
Physical Description1 online resource (xi, 265 pages)

Cover

More Information
Bibliography:Includes bibliographical references and author index.
ISBN:9781523153800
1523153806
9781605955353
1605955353
Access:Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
Physical Description:1 online resource (xi, 265 pages)

Similar Items