Thermal design of liquid cooled microelectronic equipment : thermal solutions, analysis methods, and design practices

"With the demands of increased system functionalities and performance, the system power density of microelectronics equipment is continuously increased at a fast pace. This is especially true for the telecommunications systems because the network traffic in the industry has grown very rapidly e...

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Bibliographic Details
Main Author Yeh, L.-T. 1944- (Author)
Format Electronic eBook
LanguageEnglish
Published New York, NY : ASME, [2019]
SeriesASME Press book series on electronic packaging.
Subjects
Electronic apparatus and appliances > Cooling.
Electronic apparatus and appliances > Thermal properties.
Microelectronics > Equipment and supplies.
Cold plates (Electronics)
elektronické knihy
electronic books
Online AccessFull text
ISBN9780791861936
0791861937
Physical Description1 online resource (xi, 332 pages)

Cover

Table of Contents:
  • Front Matter
  • 1. Introduction
  • 2. Fundamentals of Convective and Boiling Heat Transfer
  • 3. Key Components of Liquid Cooled Systems
  • 4. Heat Transfer from Components to Coolant
  • 5. Liquid Cooling Technologies
  • 6. Two-Phase Heat Transfer Devices
  • 7. Liquid Cooled Microelectronic Equipment
  • 8. Thermal Design Guide of Liquid Cooled Systems
  • Back Matter.

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