Thermal design of liquid cooled microelectronic equipment : thermal solutions, analysis methods, and design practices

"With the demands of increased system functionalities and performance, the system power density of microelectronics equipment is continuously increased at a fast pace. This is especially true for the telecommunications systems because the network traffic in the industry has grown very rapidly e...

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Bibliographic Details
Main Author: Yeh, L.-T. 1944- (Author)
Format: eBook
Language: English
Published: New York, NY : ASME, [2019]
Series: ASME Press book series on electronic packaging.
Subjects:
Electronic apparatus and appliances > Cooling.
Electronic apparatus and appliances > Thermal properties.
Microelectronics > Equipment and supplies.
Cold plates (Electronics)
elektronické knihy
electronic books
ISBN: 9780791861936
0791861937
Physical Description: 1 online resource (xi, 332 pages)

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Table of contents

LEADER 03370cam a2200433 i 4500
001 kn-on1140523836
003 OCoLC
005 20240717213016.0
006 m o d
007 cr cn|||||||||
008 200213s2019 nyua ob 001 0 eng d
040 |a UIU  |b eng  |e rda  |e pn  |c UIU  |d UPM  |d ASMEG  |d EQK  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCL  |d PUL 
020 |z 9780791861936  |q (hardcover) 
020 |z 0791861937  |q (hardcover) 
024 7 |a 10.1115/1.861936.  |2 doi 
035 |a (OCoLC)1140523836  |z (OCoLC)1258242310 
041 7 |a eng  |2 iso639-3 
100 1 |a Yeh, L.-T.  |q (Lian-Tuu),  |d 1944-  |e author. 
245 1 0 |a Thermal design of liquid cooled microelectronic equipment :  |b thermal solutions, analysis methods, and design practices /  |c L.T. Yeh. 
264 1 |a New York, NY :  |b ASME,  |c [2019] 
300 |a 1 online resource (xi, 332 pages) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a ASME Press book series on electronic packaging 
504 |a Includes bibliographical references and index. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a "With the demands of increased system functionalities and performance, the system power density of microelectronics equipment is continuously increased at a fast pace. This is especially true for the telecommunications systems because the network traffic in the industry has grown very rapidly every year. For the high power air cooled systems, large high performance fans are becoming a must for the systems in order to provide the necessary air flow rates. Two major concerns about these large fans are the power consumption and the acoustic noise of the fans. In addition, the increase in the system power results in a significant increase in the operation cost of the equipment as well as its host facilities such as the date centers. Liquid cooling can not only resolve the above mentioned issues related to high power air-cooled systems but also enhance its system performance and reliability. For some cases, the system power is too high to be cooled by air thermally. The only solution to such situations is adopting the liquid cooling"--  |c Provided by publisher 
505 0 |a Front Matter -- 1. Introduction -- 2. Fundamentals of Convective and Boiling Heat Transfer -- 3. Key Components of Liquid Cooled Systems -- 4. Heat Transfer from Components to Coolant -- 5. Liquid Cooling Technologies -- 6. Two-Phase Heat Transfer Devices -- 7. Liquid Cooled Microelectronic Equipment -- 8. Thermal Design Guide of Liquid Cooled Systems -- Back Matter. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Electronic apparatus and appliances  |x Cooling. 
650 0 |a Electronic apparatus and appliances  |x Thermal properties. 
650 0 |a Microelectronics  |x Equipment and supplies. 
650 0 |a Cold plates (Electronics) 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
776 0 8 |i Print version:  |z 9780791861936  |w (DLC) 2019020787  |w (OCoLC)1100448412 
830 0 |a ASME Press book series on electronic packaging. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpTDLCME03/thermal-design-of?kpromoter=marc  |y Full text 

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