Modeling, analysis, design, and tests for electronics packaging beyond Moore

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Bibliographic Details
Main Authors Zhang, Hengyun (Author), Che, Faxing (Author), Lin, Tingyu (Author), Zhao, Wensheng (Author)
Format Electronic eBook
LanguageEnglish
Published Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]
SeriesWoodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials.
Subjects
Electronic apparatus and appliances > Packaging.
elektronické knihy
electronic books
Online AccessFull text
ISBN9780081025338
0081025335
9780081025321
0081025327
Physical Description1 online resource

Cover

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020 |a 0081025335  |q (electronic bk.) 
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035 |a (OCoLC)1128034384 
100 1 |a Zhang, Hengyun,  |e author. 
245 1 0 |a Modeling, analysis, design, and tests for electronics packaging beyond Moore /  |c Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao. 
264 1 |a Duxford, United Kingdom :  |b Woodhead Publishing, an imprint of Elsevier,  |c [2020] 
300 |a 1 online resource 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Woodhead Publishing series in electronic and optical materials 
490 1 |a Series on advanced electronic packaging technology and key materials 
504 |a Includes bibliographical references and index. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Electronic apparatus and appliances  |x Packaging. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Che, Faxing,  |e author. 
700 1 |a Lin, Tingyu,  |e author. 
700 1 |a Zhao, Wensheng,  |e author. 
776 0 8 |i Print version:  |a Zhang, Hengyun.  |t Modeling, analysis, design, and tests for electronics packaging beyond Moore  |z 0081025327  |z 9780081025321  |w (OCoLC)1071140290 
830 0 |a Woodhead Publishing series in electronic and optical materials. 
830 0 |a Series on advanced electronic packaging technology and key materials. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpMADTEPM1/modeling-analysis-design?kpromoter=marc  |y Full text 

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