Modeling, analysis, design, and tests for electronics packaging beyond Moore

Saved in:
Bibliographic Details
Main Authors Zhang, Hengyun (Author), Che, Faxing (Author), Lin, Tingyu (Author), Zhao, Wensheng (Author)
Format Electronic eBook
LanguageEnglish
Published Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]
SeriesWoodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials.
Subjects
Electronic apparatus and appliances > Packaging.
elektronické knihy
electronic books
Online AccessFull text
ISBN9780081025338
0081025335
9780081025321
0081025327
Physical Description1 online resource

Cover

More Information
Bibliography:Includes bibliographical references and index.
ISBN:9780081025338
0081025335
9780081025321
0081025327
Access:Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
Physical Description:1 online resource

Similar Items