Modeling, analysis, design, and tests for electronics packaging beyond Moore

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Bibliographic Details
Main Authors: Zhang, Hengyun, (Author), Che, Faxing, (Author), Lin, Tingyu, (Author), Zhao, Wensheng, (Author)
Format: eBook
Language: English
Published: Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]
Series: Woodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials.
Subjects:
Electronic apparatus and appliances > Packaging.
elektronické knihy
electronic books
ISBN: 9780081025338
0081025335
9780081025321
0081025327
Physical Description: 1 online resource

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Bibliography: Includes bibliographical references and index.
ISBN: 9780081025338
0081025335
9780081025321
0081025327
Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty

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