Harsh environment electronics : interconnect materials and performance assessment
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barrie...
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| Other Authors | |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Weinheim, Germany :
Wiley-VCH Verlag GmbH & Co.,
[2019]
|
| Subjects | |
| Online Access | Full text |
| ISBN | 9783527813995 3527813993 9783527813964 3527813969 9783527344192 3527344195 9783527813971 3527813977 |
| Physical Description | 1 online resource |