Encapsulation technologies for electronic applications

• Main Authors: Ardebili, Haleh (Author), Zhang, Jiawei (Author), Pecht, Michael (Author)
• Format: Electronic eBook
• Language: English
• Published: Oxford, United Kingdom : William Andrew, [2019]
• Edition: Second edition.
• Series: Materials and processes for electronic applications series.
• Subjects: Electronic apparatus and appliances > Plastic embedment.; elektronické knihy; electronic books
• ISBN: 9780128119792; 0128119799; 9780128119785; 0128119780
• Physical Description: 1 online resource : illustrations

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D...