Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan

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Bibliographic Details
Corporate Author Electronic Packaging Interconnect Technology Symposium Fukuoka
Other Authors Nogita, Kazuhiro (Editor), Salleh, Mohd Arif Anuar Mohd (Editor), Abdullah, Mohd Mustafa Al Bakri (Editor), Jamaludin, Liyana (Editor), Mohd Tahir, Muhammad Faheem (Editor)
Format Electronic eBook
LanguageEnglish
Published Zurich : Trans Tech Publications Ltd, [2018]
SeriesDiffusion and defect data. Solid state phenomena ; volume 273.
Subjects
Electronic packaging > Congresses.
Electronic packaging > Materials > Congresses.
elektronické knihy
electronic books
Online AccessFull text
ISBN9783035733242
3035733244
9783035713244
Physical Description1 online resource

Cover

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264 1 |a Zurich :  |b Trans Tech Publications Ltd,  |c [2018] 
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490 1 |a Solid state phenomena ;  |v volume 273 
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590 |a Knovel  |b Knovel (All titles) 
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650 0 |a Electronic packaging  |x Materials  |v Congresses. 
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700 1 |a Nogita, Kazuhiro,  |e editor. 
700 1 |a Salleh, Mohd Arif Anuar Mohd,  |e editor. 
700 1 |a Abdullah, Mohd Mustafa Al Bakri,  |e editor. 
700 1 |a Jamaludin, Liyana,  |e editor. 
700 1 |a Mohd Tahir, Muhammad Faheem,  |e editor. 
830 0 |a Diffusion and defect data.  |n Pt. B,  |p Solid state phenomena ;  |v volume 273. 
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