Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan

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Bibliographic Details
Corporate Author: Electronic Packaging Interconnect Technology Symposium Fukuoka)
Other Authors: Nogita, Kazuhiro, (Editor), Salleh, Mohd Arif Anuar Mohd, (Editor), Abdullah, Mohd Mustafa Al Bakri, (Editor), Jamaludin, Liyana, (Editor), Mohd Tahir, Muhammad Faheem, (Editor)
Format: eBook
Language: English
Published: Zurich : Trans Tech Publications Ltd, [2018]
Series: Diffusion and defect data. Solid state phenomena ; volume 273.
Subjects:
Electronic packaging > Congresses.
Electronic packaging > Materials > Congresses.
elektronické knihy
electronic books
ISBN: 9783035733242
3035733244
9783035713244
Physical Description: 1 online resource

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Table of contents

LEADER 02172cam a2200421 i 4500
001 kn-on1031999704
003 OCoLC
005 20240717213016.0
006 m o d
007 cr cn|||||||||
008 180423s2018 sz o 100 0 eng d
040 |a N$T  |b eng  |e rda  |e pn  |c N$T  |d N$T  |d OCLCF  |d K6U  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCO 
020 |a 9783035733242  |q (electronic bk.) 
020 |a 3035733244  |q (electronic bk.) 
020 |z 9783035713244 
035 |a (OCoLC)1031999704 
111 2 |a Electronic Packaging Interconnect Technology Symposium  |d (2017 :  |c Fukuoka) 
245 1 0 |a Electronic packaging interconnect technology :  |b Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /  |c edited by Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir. 
264 1 |a Zurich :  |b Trans Tech Publications Ltd,  |c [2018] 
264 4 |c ©2018 
300 |a 1 online resource 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Solid state phenomena ;  |v volume 273 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Electronic packaging  |v Congresses. 
650 0 |a Electronic packaging  |x Materials  |v Congresses. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Nogita, Kazuhiro,  |e editor. 
700 1 |a Salleh, Mohd Arif Anuar Mohd,  |e editor. 
700 1 |a Abdullah, Mohd Mustafa Al Bakri,  |e editor. 
700 1 |a Jamaludin, Liyana,  |e editor. 
700 1 |a Mohd Tahir, Muhammad Faheem,  |e editor. 
830 0 |a Diffusion and defect data.  |n Pt. B,  |p Solid state phenomena ;  |v volume 273. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpEPITEPI1/electronic-packaging-interconnect?kpromoter=marc  |y Full text 

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