Hermeticity testing of MEMS and microelectronic packages

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mecha...

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Bibliographic Details
Main Authors: Costello, Suzanne, (Author), Desmulliez, Marc P. Y., 1963- (Author)
Format: eBook
Language: English
Published: Boston : Artech House, [2013]
Series: Artech House integrated microsystems series.
Subjects:
Microelectronic packaging > Testing.
Microelectromechanical systems > Testing.
Hermetic sealing > Testing.
Microelectronics > Testing.
elektronické knihy
electronic books
ISBN: 9781608075287
1608075281
9781523117284
1523117281
9781608075270
1608075273
Physical Description: 1 online resource (195 pages .)

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Table of contents

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001 kn-ocn893521784
003 OCoLC
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006 m o d
007 cr cn|||||||||
008 141021s2013 enka ob 001 0 eng d
040 |a YDXCP  |b eng  |e pn  |c YDXCP  |d OCLCO  |d OCLCQ  |d EBLCP  |d DEBSZ  |d OCLCQ  |d LOA  |d OCLCQ  |d MOR  |d PIFAG  |d ZCU  |d MERUC  |d OCLCQ  |d U3W  |d COCUF  |d STF  |d OCLCQ  |d OCLCF  |d ICG  |d VLB  |d MERER  |d CUY  |d VT2  |d UMR  |d ERL  |d OCLCQ  |d WYU  |d OCLCQ  |d LVT  |d KNOVL  |d DKC  |d OCLCQ  |d UKBTH  |d HS0  |d TUHNV  |d OCLCO  |d IEEEE  |d S2H  |d OCLCQ  |d UPM  |d OCLCQ  |d INARC  |d OCLCO  |d OCLCL  |d SXB 
020 |a 9781608075287  |q (electronic bk.) 
020 |a 1608075281  |q (electronic bk.) 
020 |a 9781523117284  |q (electronic bk.) 
020 |a 1523117281  |q (electronic bk.) 
020 |z 9781608075270 
020 |z 1608075273 
035 |a (OCoLC)893521784  |z (OCoLC)891446848  |z (OCoLC)960201581  |z (OCoLC)961529739  |z (OCoLC)962606807  |z (OCoLC)988489976  |z (OCoLC)991991047  |z (OCoLC)1018075450  |z (OCoLC)1023007520  |z (OCoLC)1027034080  |z (OCoLC)1037785083  |z (OCoLC)1159662319  |z (OCoLC)1162582654  |z (OCoLC)1227633131  |z (OCoLC)1243611581  |z (OCoLC)1289517317  |z (OCoLC)1290058183 
100 1 |a Costello, Suzanne,  |e author. 
245 1 0 |a Hermeticity testing of MEMS and microelectronic packages /  |c Suzanne Costello, Marc P.Y. Desmulliez. 
264 1 |a Boston :  |b Artech House,  |c [2013] 
264 4 |c ©2013 
300 |a 1 online resource (195 pages .) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Integrated microsystems series 
504 |a Includes bibliographical references and index. 
505 0 |a Preface; References; Part 1 Introduction to Hermetic Package; 1 The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication ; 1.1 Introduction; 1.2 The Evolution of Microelectronics and MEMS Packages; 1.3 MEMS Sealing Techniques and Mode Package Fabrication; 1.3.1 Materials; 1.3.2 Sealing Techniques; 1.4 Summary of MEMS Packaging Materials and Techniques; References; 2 Assembly, Packaging, and Environmentally Induced Failures in MEMS; 2.1 Introduction; 2.2 Particle Contamination ; 2.3 Thermomechanical Constraints; 2.3.1 Thermomechanical Constraints in Di. 
505 8 |a 2.3.2 Thermomechanical Constraints in Pa2.3.3 Thermomechanical Constraints in Wa; 2.3.4 Thermomechanical Constraints in Fl; 2.4 Moisture and Gas Absorption; 2.4.1 Moisture Absorption; 2.4.2 Barrier Coatings: A Protection Aga; 2.4.3 Outgassing; 2.5 Conclusions: Reliability Demonstration and Accelerated Testing; References; 3 Packaging Requirements for Hermeticity; 3.1 The Need for Hermeticity in MEMS and; 3.2 Balancing Maximum Permissive Leak Ra; References; 4 The Different Types of Leaks in MEMS and Microelectronics Packaging; 4.1 Introduction; 4.2 Leak Channels or Capillary Leaks. 
505 8 |a 4.3 Permeation4.4 Outgassing; 4.5 Conclusion; References; Part 2 Traditional Hermeticity Test Techniques and Standards; 5 Ex Situ Hermeticity Test Methods; 5.1 Introduction; 5.2 Fine Leak Tests; 5.2.1 Helium Fine Leak Test; 5.2.2 Radioisotope Leak Detection Method; 5.3 Gross Leak Tests; 5.3.1 Fluorocarbon Liquid and Vapor Gross Leak Detection; 5.3.2 Gross Bubble Test; 5.3.3 Weight Gain; 5.3.4 Dye Penetrant Gross Leak Test; 5.4 Combinational Tests; 5.4.1 Optical Fine/Gross Leak Detection ; 5.4.2 Cumulative Helium Leak Detection (CHLD) Method; References. 
505 8 |a 6 The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 10716.1 Introduction: The First Hermeticity Tests; 6.2 The Introduction of the Military Standards; 6.3 The First Problems with Traditional Hermeticity Tests and Standards; 6.4 Military Standard Revisions; 6.5 Summary; References; Part 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages; 7 Permeation; 7.1 Introduction; 7.2 Mathematics of Permeation; 7.3 Limitations of the Packaging Material; 7.4 Conclusions; References; 8 Outgassing and Residual Gas Analysis (RGA); 8.1 Outgassing. 
505 8 |a 8.2 Residual Gas AnalysisReferences; 9 Low-Cavity Volume Capillary Leak Limitatations; 9.1 Limitations of the Helium Fine Leak Test Method; 9.1.1 Volume Limitations; 9.1.2 Minimum Detectable Leak Rate; References; Part 4 Novel Methods of Leak Detection; 10 Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method; 10.1 Introduction; 10.2 Lumped Element Modeling of a Microresonator; 10.3 Definitions and Measurement Methods of the Quality Factor Q; 10.3.1 Definition in Terms of Stored Energy; 10.3.2 Definition in Terms of Bandwidth. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Microelectronic packaging  |x Testing. 
650 0 |a Microelectromechanical systems  |x Testing. 
650 0 |a Hermetic sealing  |x Testing. 
650 0 |a Microelectronics  |x Testing. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Desmulliez, Marc P. Y.,  |d 1963-  |e author.  |1 https://id.oclc.org/worldcat/entity/E39PBJfMpwtwkv7gB94xwDwDMP 
776 0 8 |i Print version:  |a Costello, Suzanne.  |t Hermeticity testing of MEMS and microelectronic packages.  |d Boston : Artech House, [2013]  |z 9781608075270  |z 1608075273 
830 0 |a Artech House integrated microsystems series. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpHTMEMSM3/hermeticity-testing-of?kpromoter=marc  |y Full text 

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