Hermeticity testing of MEMS and microelectronic packages
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mecha...
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Main Authors: | , |
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Format: | eBook |
Language: | English |
Published: |
Boston :
Artech House,
[2013]
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Series: | Artech House integrated microsystems series.
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Subjects: | |
ISBN: | 9781608075287 1608075281 9781523117284 1523117281 9781608075270 1608075273 |
Physical Description: | 1 online resource (195 pages .) |
Summary: | Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in. |
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Bibliography: | Includes bibliographical references and index. |
ISBN: | 9781608075287 1608075281 9781523117284 1523117281 9781608075270 1608075273 |
Access: | Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty |