Reliability and failure of electronic materials and devices

"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus...

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Bibliographic Details
Main Author: Ohring, Milton, 1936-
Other Authors: Kasprzak, Lucian.
Format: eBook
Language: English
Published: Amsterdam ; Boston : Academic Press is an imprint of Elsevier, 2014.
Edition: Second edition.
Subjects:
Electronic apparatus and appliances > Reliability.
System failures (Engineering)
elektronické knihy
electronic books
ISBN: 9780080575520
0080575528
9780120885749
0120885743
9780128100363
Physical Description: 1 online resource

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Table of contents

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020 |a 9780080575520  |q (electronic bk.) 
020 |a 0080575528  |q (electronic bk.) 
020 |z 9780120885749 
020 |z 0120885743 
020 |z 9780128100363 
024 8 |a C20090057481 
024 8 |a 9780120885749 
035 |a (OCoLC)893439517  |z (OCoLC)893737412  |z (OCoLC)896836272  |z (OCoLC)897116893  |z (OCoLC)960707596  |z (OCoLC)961887266  |z (OCoLC)987956187  |z (OCoLC)988657489  |z (OCoLC)999476198  |z (OCoLC)1105795828  |z (OCoLC)1162124293 
100 1 |a Ohring, Milton,  |d 1936-  |1 https://id.oclc.org/worldcat/entity/E39PBJhxrwxptqGktB3my4WxDq 
245 1 0 |a Reliability and failure of electronic materials and devices /  |c Milton Ohring, Lucian Kasprzak. 
250 |a Second edition. 
264 1 |a Amsterdam ;  |a Boston :  |b Academic Press is an imprint of Elsevier,  |c 2014. 
300 |a 1 online resource 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
500 |a Includes index. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a "Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"--  |c Provided by publisher 
500 |a Machine generated contents note: CH 1 An Overview of Electronic Devices and Their Reliability CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated CH 3 Defects, Contamination and Yield CH 4 The Mathematics of Failure and Reliability CH 5 Mass Transport-Induced Failure Ch 6 Electronic Charge-Induced Damage CH 7 Environmental Damage to Electronic Products CH 8 Packaging Materials, Processes, and Stresses CH 9 Degradation of Contacts and Packages CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices CH 11 Characterization and Failure Analysis of Material, Devices and Packages CH 12 Future Directions and Reliability Issues. 
505 0 |a FrontCover; FM-CTR-01; DEDICATION; CONTENTS; Chapter 11 -- Characterization and Failure Analysis of Materials and Devices; PREFACE TO THE FIRST EDITION; 1.1 ELECTRONIC PRODUCTS; 1.3 FAILURE PHYSICS; 1.4 SUMMARY AND PERSPECTIVE; REFERENCES; 2.7 GAAS DEVICES; 2.8 ELECTRO-OPTICAL DEVICES; 2.9 PROCESSING-THE CHIP LEVEL; 2.10 MICROELECTROMECHANICAL SYSTEMS; EXERCISES; REFERENCES; 4.8 EPILOGUE-FINAL COMMENT; EXERCISES; REFERENCES; 5.2 DIFFUSION AND ATOM MOVEMENTS IN SOLIDS; 6.2 ASPECTS OF CONDUCTION IN INSULATORS; 7.2 ATMOSPHERIC CONTAMINATION AND MOISTURE; 8.5 THERMAL STRESSES IN PACKAGE STRUCTURES. 
505 8 |a 9.2 the nature of contacts11.2 nondestructive examination and decapsulation; 12.2 integrated circuit technology trends; acronyms. 
504 |a Includes bibliographical references and index. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Electronic apparatus and appliances  |x Reliability. 
650 0 |a System failures (Engineering) 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Kasprzak, Lucian. 
776 0 8 |i Print version:  |a Ohring, Milton, 1936-  |t Reliability and failure of electronic materials and devices.  |b Second edition  |z 9780120885749  |w (DLC) 2014031265  |w (OCoLC)887187586 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpRFEMDE06/reliability-and-failure?kpromoter=marc  |y Full text 

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