Description: Three-dimensional molded interconnect devices (3D-MID) :

Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers

Saved in:

Bibliographic Details
Main Author:	Franke, Jörg (Prof. Dr.-Ing.), (Author)
Format:	eBook
Language:	English
Published:	Munich ; Cincinnati, OH : Hanser, [2014]
Subjects:	Interconnects (Integrated circuit technology) > Design and construction. Injection molding of plastics. elektronické knihy electronic books
ISBN:	9781569905524 1569905525 9781680157277 1680157272 9781569905517 1569905517
Physical Description:	1 online resource (xii, 356 pages) : color illustrations

Description
Item Description:	Translated from the German.
Bibliography:	Includes bibliographical references and index.
ISBN:	9781569905524 1569905525 9781680157277 1680157272 9781569905517 1569905517
Access:	Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty