Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers

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Bibliographic Details
Main Author Franke, Jörg (Prof. Dr.-Ing.) (Author)
Format Electronic eBook
LanguageEnglish
Published Munich ; Cincinnati, OH : Hanser, [2014]
Subjects
Interconnects (Integrated circuit technology) > Design and construction.
Injection molding of plastics.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781569905524
1569905525
9781680157277
1680157272
9781569905517
1569905517
Physical Description1 online resource (xii, 356 pages) : color illustrations

Cover

More Information
Item Description:Translated from the German.
Bibliography:Includes bibliographical references and index.
ISBN:9781569905524
1569905525
9781680157277
1680157272
9781569905517
1569905517
Access:Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
Physical Description:1 online resource (xii, 356 pages) : color illustrations

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