Handbook of thin film deposition : techniques, processes, and technologies

The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory...

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Bibliographic Details
Other Authors: Seshan, Krishna.
Format: eBook
Language: English
Published: Waltham [Mass.] : William Andrew, 2012.
Edition: 3rd ed.
Subjects:
Thin film devices > Design and construction > Handbooks, manuals, etc.
Thin films.
Thin film devices > Design and construction.
elektronické knihy
electronic books
ISBN: 1437778747
9781437778748
9781437778731
1437778739
1283716895
9781283716895
Physical Description: 1 online resource (xviii, 392 pages)

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Table of contents

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008 120730s2012 nyu of 000 0 eng d
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020 |z 9781437778731  |q (hbk.) 
020 |z 1437778739  |q (hbk.) 
020 |a 1283716895 
020 |a 9781283716895 
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245 0 0 |a Handbook of thin film deposition :  |b techniques, processes, and technologies /  |c edited by Krishna Seshan. 
250 |a 3rd ed. 
260 |a Waltham [Mass.] :  |b William Andrew,  |c 2012. 
300 |a 1 online resource (xviii, 392 pages) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
504 |a Includes bibliographical references and index. 
505 0 |a Front Cover; Handbook of Thin Film Deposition; Copyright Page; Contents; Foreword; Preface; Acknowledgments; About the Editor; List of Contributors; SCALING; Introduction to Chapter 1; 1 A Perspective on Today's Scaling Challenges and Possible Future Directions; 1.1 Introduction; 1.2 Review and Update of Generalized Scaling; 1.3 Energy/Performance Considerations; 1.4 Design Issues with Back-Gated Thin SOI CMOS; 1.5 Carrier Confinement and Quantization Effects; 1.6 Potential of Low-Temperature Operation; 1.7 Conclusion; Acknowledgments; References. 
505 8 |a 2 Scaling and Its Implications for the Integration and Design of Thin Film and Processes2.1 Scaling: Basics, Causes, and Consequences; 2.1.1 Moore's Law; 2.1.2 Dennard's Scaling Theory; 2.1.3 Causes and Consequences of Scaling; Causes; Consequences; Gate Oxide and Vertical Scaling; 2.1.4 Challenges and Limiters; 2.2 FEOL Scaling: State of the Art Transistors Described in Refs [51,52]; 2.2.1 Role of Lithography; 2.2.2 The Design Cycle: How Scaling Is Implemented; Migration to a New Process; Logic Characterization Phase; Design Phase; 2.2.3 Going Beyond FEOL Scaling Limits; Gate Scaling. 
505 8 |a Strain Engineering for Enhancing MobilityLeakage Issues; Transistor Parameters: Vt, Tox, and L: Why Does Leakage and Power Consumed per Transistor Increase with Scaling?; 2.3 Silicon on Insulator and System on a Chip; 2.3.1 Silicon Substrate and Scaling; Silicon and Silicon Oxide; 2.3.2 Necessity and Advantages of SOI; SOI References; Advantages of SOI-DRAM; Advantages of SOI for Microprocessors; New Material: Graphine FET; Strained SOI; 2.4 Back End of the Line Scaling; 2.4.1 Limiters to Back-End Scaling; 2.4.2 Change to Cu-Low K; Input-Output, IO, Scaling-Rent's Rule [35] 
505 8 |a Technology Nodes and Wiring Layers2.5 International Technology Roadmap for Semiconductors, See Ref. [65]; 2.6 Miscellaneous Effects; 2.6.1 Scaling and Contamination; 2.6.2 IO Scaling: Pb-Free Initiative [47]; 2.6.3 Materials Changes and Challenges; 2.6.4 IBM 7 C4 Pb Bump Process; 2.6.5 New Materials and Memory Scaling; 2.7 Scaling and Reliability [38,40,63]; 2.7.1 Technology Scaling and Wiring Layers; 2.8 Economics of Scaling; 2.9 Summary and Conclusions; Acknowledgments; References; Appendix 1: Basis for Scaling: Shannon's Theorem; Appendix 2: Rent's Rule and Consequences for Scaling. 
505 8 |a Appendix 3: Comparison of Changes and New Materials Going from Micro- to NanotransistorsAppendix 4: Summary of Back-End Changes in Materials and Processing; Appendix 5: List of Abbreviations; 3 Scaling-Its Effects on Heat Generation and Cooling of Devices. A "Thermal Moore's" Law?; 3.1 Purpose of This Section; 3.2 Heat Generation Trends from Chips; 3.3 The Chip-Cooling Problem and Its Importance; 3.4 Definition of TDP, Thermal Resistance, TDD Versus SPECINT; and Their Use [4]; 3.5 Where Is the Need for Cooling?; 3.5.1 Heat Dissipation When Power Is Off; 3.5.2 Conclusions. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical depo. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Thin film devices  |x Design and construction  |v Handbooks, manuals, etc. 
650 0 |a Thin films. 
650 0 |a Thin film devices  |x Design and construction. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Seshan, Krishna. 
776 0 8 |i Print version:  |z 9781437778731  |z 1437778739 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpHTFDTPT2/handbook-of-thin?kpromoter=marc  |y Full text 

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