Adhesives technology for electronic applications : materials, processing, reliability

This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives.

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Bibliographic Details
Main Author Licari, James J., 1930-
Other Authors Swanson, Dale W.
Format Electronic eBook
LanguageEnglish
Published Amsterdam ; Boston : William Andrew Pub., 2011.
Edition2nd ed.
SeriesMaterials and processes for electronic applications series.
Subjects
Electronics > Materials.
Adhesives.
Electronic packaging.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781437778908
1437778909
9781437778892
1437778895
Physical Description1 online resource (viii, 403 pages) : illustrations.

Cover

Table of Contents:
  • Machine generated contents note: 1.Introduction
  • 2.Functions and theory of adhesives
  • 3.Chemistry, Formulation, and Properties of Adhesives
  • 4.Adhesive Bonding Processes
  • 5.Applications
  • 6.Reliability
  • 7.Test and Inspection Methods.

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