Adhesives technology for electronic applications : materials, processing, reliability

This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives.

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Bibliographic Details
Main Author: Licari, James J., 1930-
Other Authors: Swanson, Dale W.
Format: eBook
Language: English
Published: Amsterdam ; Boston : William Andrew Pub., 2011.
Edition: 2nd ed.
Series: Materials and processes for electronic applications series.
Subjects:
Electronics > Materials.
Adhesives.
Electronic packaging.
elektronické knihy
electronic books
ISBN: 9781437778908
1437778909
9781437778892
1437778895
Physical Description: 1 online resource (viii, 403 pages) : illustrations.

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Table of contents

LEADER 02938cam a2200445 a 4500
001 kn-ocn761074590
003 OCoLC
005 20240717213016.0
006 m o d
007 cr cn|||||||||
008 111115s2011 ne a ob 001 0 eng d
040 |a KNOVL  |b eng  |e pn  |c KNOVL  |d COO  |d DEBSZ  |d OCLCQ  |d ZCU  |d OCLCQ  |d TEFOD  |d KNOVL  |d OCLCF  |d KNOVL  |d TEFOD  |d OCLCQ  |d VT2  |d STF  |d OCLCQ  |d UAB  |d OCLCQ  |d BUF  |d CEF  |d RRP  |d AU@  |d WYU  |d YOU  |d YDX  |d LVT  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCL  |d OCLCQ  |d OCLCL  |d SXB 
020 |a 9781437778908  |q (electronic bk.) 
020 |a 1437778909  |q (electronic bk.) 
020 |a 9781437778892 
020 |a 1437778895 
035 |a (OCoLC)761074590  |z (OCoLC)961882695  |z (OCoLC)988619586  |z (OCoLC)993448412  |z (OCoLC)999411610  |z (OCoLC)1058062146  |z (OCoLC)1065675463  |z (OCoLC)1086928207  |z (OCoLC)1097135063  |z (OCoLC)1148194183  |z (OCoLC)1229572196 
100 1 |a Licari, James J.,  |d 1930-  |1 https://id.oclc.org/worldcat/entity/E39PCjFcjWxggdTwcQ4fPhJvH3 
245 1 0 |a Adhesives technology for electronic applications :  |b materials, processing, reliability /  |c James J. Licari and Dale W. Swanson. 
250 |a 2nd ed. 
260 |a Amsterdam ;  |a Boston :  |b William Andrew Pub.,  |c 2011. 
300 |a 1 online resource (viii, 403 pages) :  |b illustrations. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Materials and processes for electronic applications series 
504 |a Includes bibliographical references and index. 
505 0 |a Machine generated contents note: 1.Introduction -- 2.Functions and theory of adhesives -- 3.Chemistry, Formulation, and Properties of Adhesives -- 4.Adhesive Bonding Processes -- 5.Applications -- 6.Reliability -- 7.Test and Inspection Methods. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 8 |a This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Electronics  |x Materials. 
650 0 |a Adhesives. 
650 0 |a Electronic packaging. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Swanson, Dale W. 
776 0 8 |i Print version:  |a Licari, James J., 1930-  |t Adhesives technology for electronic applications.  |b 2nd ed.  |d Amsterdam ; Boston : William Andrew Pub., 2011  |z 9781437778892  |w (DLC) 2011292645  |w (OCoLC)754186880 
830 0 |a Materials and processes for electronic applications series. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpATEAMP01/adhesives-technology-for?kpromoter=marc  |y Full text 

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