Adhesives technology for electronic applications : materials, processing, reliability

This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives.

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Bibliographic Details
Main Author: Licari, James J., 1930-
Other Authors: Swanson, Dale W.
Format: eBook
Language: English
Published: Amsterdam ; Boston : William Andrew Pub., 2011.
Edition: 2nd ed.
Series: Materials and processes for electronic applications series.
Subjects:
Electronics > Materials.
Adhesives.
Electronic packaging.
elektronické knihy
electronic books
ISBN: 9781437778908
1437778909
9781437778892
1437778895
Physical Description: 1 online resource (viii, 403 pages) : illustrations.

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Description
Summary: This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives.
Bibliography: Includes bibliographical references and index.
ISBN: 9781437778908
1437778909
9781437778892
1437778895
Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty

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