Adhesives technology for electronic applications : materials, processing, reliability
This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives.
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| Main Author | |
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| Other Authors | |
| Format | Electronic eBook |
| Language | English |
| Published |
Amsterdam ; Boston :
William Andrew Pub.,
2011.
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| Edition | 2nd ed. |
| Series | Materials and processes for electronic applications series.
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| Subjects | |
| Online Access | Full text |
| ISBN | 9781437778908 1437778909 9781437778892 1437778895 |
| Physical Description | 1 online resource (viii, 403 pages) : illustrations. |
Cover
| Summary: | This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives. |
|---|---|
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9781437778908 1437778909 9781437778892 1437778895 |
| Access: | Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty |
| Physical Description: | 1 online resource (viii, 403 pages) : illustrations. |