Lead-free solder interconnect reliability

• Other Authors: Shangguan, Dongkai, 1963-
• Format: eBook
• Language: English
• Published: Materials Park, OH : ASM International, 2005.
• Subjects: Microelectronic packaging > Reliability.; Solder and soldering.; Lead-free electronics manufacturing processes.; elektronické knihy; electronic books
• ISBN: 9781615030934; 161503093X; 9780871708168; 0871708167
• Physical Description: 1 online resource (x, 292 pages) : illustrations