Introduction to microsystem packaging technology

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process-including design and manufacturing technologies-is the technical foundation upon which function chips are updated for use in...

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Bibliographic Details
Main Author Jin, Yufeng
Other Authors Wang, Zhiping, 1962 October 6-, Chen, Jing, 1974-
Format Electronic eBook
LanguageEnglish
Published Boca Raton, FL : CRC Press/Taylor & Francis, ©2011.
Subjects
Microelectronic packaging.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781439865972
1439865973
9781628706727
1628706724
9781439819104
1439819106
Physical Description1 online resource (xiii, 218 pages) : illustrations

Cover

Table of Contents:
  • Ch. 1. Introduction
  • ch. 2. Design technique for microsystems packaging and integration
  • ch. 3. Substrate technology
  • ch. 4. Interconnection technology
  • ch. 5. Device-level packaging
  • ch. 6. MEMS packaging
  • ch. 7. Module assembly and optoelectronic packaging
  • ch. 8. System-level packaging technology
  • ch. 9. Reliability
  • ch. 10. Prospects for microsystems packaging technology.

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