Introduction to microsystem packaging technology

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process-including design and manufacturing technologies-is the technical foundation upon which function chips are updated for use in...

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Bibliographic Details
Main Author: Jin, Yufeng.
Other Authors: Wang, Zhiping, 1962 October 6-, Chen, Jing, 1974-
Format: eBook
Language: English
Published: Boca Raton, FL : CRC Press/Taylor & Francis, ©2011.
Subjects:
Microelectronic packaging.
elektronické knihy
electronic books
ISBN: 9781439865972
1439865973
9781628706727
1628706724
9781439819104
1439819106
Physical Description: 1 online resource (xiii, 218 pages) : illustrations

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Table of contents

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020 |a 9781439865972  |q (electronic bk.) 
020 |a 1439865973  |q (electronic bk.) 
020 |a 9781628706727  |q (electronic bk.) 
020 |a 1628706724  |q (electronic bk.) 
020 |z 9781439819104  |q (hardcover ;  |q alk. paper) 
020 |z 1439819106  |q (hardcover ;  |q alk. paper) 
035 |a (OCoLC)727983482  |z (OCoLC)991897579  |z (OCoLC)994898680  |z (OCoLC)1015206715  |z (OCoLC)1063887290 
100 1 |a Jin, Yufeng. 
245 1 0 |a Introduction to microsystem packaging technology /  |c Yufeng Jin, Zhiping Wang, Jing Chen. 
260 |a Boca Raton, FL :  |b CRC Press/Taylor & Francis,  |c ©2011. 
300 |a 1 online resource (xiii, 218 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
504 |a Includes bibliographical references and index. 
505 0 |a Ch. 1. Introduction -- ch. 2. Design technique for microsystems packaging and integration -- ch. 3. Substrate technology -- ch. 4. Interconnection technology -- ch. 5. Device-level packaging -- ch. 6. MEMS packaging -- ch. 7. Module assembly and optoelectronic packaging -- ch. 8. System-level packaging technology -- ch. 9. Reliability -- ch. 10. Prospects for microsystems packaging technology. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process-including design and manufacturing technologies-is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Microelectronic packaging. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Wang, Zhiping,  |d 1962 October 6-  |1 https://id.oclc.org/worldcat/entity/E39PCjrGrrvCVFHgMWjDJkwvjK 
700 1 |a Chen, Jing,  |d 1974-  |1 https://id.oclc.org/worldcat/entity/E39PCjwpy6Y3C4JGxgMGGCBqpK 
776 0 8 |i Print version:  |a Jin, Yufeng.  |t Introduction to microsystem packaging technology.  |d Boca Raton, FL : CRC Press/Taylor & Francis, ©2011  |z 9781439819104  |w (DLC) 2009045580  |w (OCoLC)377864839 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpIMPT0004/introduction-to-microsystem?kpromoter=marc  |y Full text 

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