Introduction to microsystem packaging technology

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process-including design and manufacturing technologies-is the technical foundation upon which function chips are updated for use in...

Full description

Saved in:
Bibliographic Details
Main Author: Jin, Yufeng.
Other Authors: Wang, Zhiping, 1962 October 6-, Chen, Jing, 1974-
Format: eBook
Language: English
Published: Boca Raton, FL : CRC Press/Taylor & Francis, ©2011.
Subjects:
ISBN: 9781439865972
1439865973
9781628706727
1628706724
9781439819104
1439819106
Physical Description: 1 online resource (xiii, 218 pages) : illustrations

Cover

Table of contents

Description
Summary: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process-including design and manufacturing technologies-is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics.
Bibliography: Includes bibliographical references and index.
ISBN: 9781439865972
1439865973
9781628706727
1628706724
9781439819104
1439819106
Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty