MEMS packaging

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industrie...

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Bibliographic Details
Corporate Author: INSPEC (Information service)
Other Authors: Hsu, Tai-Ran.
Format: eBook
Language: English
Published: London : INSPEC, ©2004.
Series: EMIS processing series ; no. 3.
Subjects:
Microelectromechanical systems.
Microelectronic packaging.
elektronické knihy
electronic books
ISBN: 9781849190626
1849190623
9781615839629
1615839623
1282275119
9781282275119
9786612275111
6612275111
0863413358
9780863413353
Physical Description: 1 online resource (xxix, 275 pages) : illustrations

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ikona NpovdaGlossary of Terms
Online Access: Online Resources

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