Adhesives technology for electronic applications : materials, processes, reliability

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new develo...

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Bibliographic Details
Main Author: Licari, James J., 1930-
Other Authors: Swanson, Dale W.
Format: eBook
Language: English
Published: Norwich, NY : William Andrew Pub., ©2005.
Series: Materials and processes for electronic applications series.
Subjects:
Electronics > Materials.
Adhesives.
Electronic packaging.
elektronické knihy
electronic books
ISBN: 0815515138
9780815515135
1591249422
9781591249429
9780080947167
0080947166
9780815516002
0815516002
Physical Description: 1 online resource (xvi, 459 pages) : illustrations.

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Table of contents

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001 kn-ocn468750627
003 OCoLC
005 20240717213016.0
006 m o d
007 cr cn|||||||||
008 050502s2005 nyua ob 001 0 eng c
040 |a COO  |b eng  |e pn  |c COO  |d KNOVL  |d DEBSZ  |d BUF  |d BAKER  |d UBY  |d E7B  |d OCLCQ  |d DEBBG  |d OCLCQ  |d KNOVL  |d OCLCF  |d OCLCO  |d OPELS  |d B24X7  |d ZCU  |d KNOVL  |d YDXCP  |d AU@  |d N$T  |d IDEBK  |d OCLCQ  |d VT2  |d UAB  |d REB  |d D6H  |d OCLCQ  |d CEF  |d RRP  |d COO  |d WYU  |d YOU  |d LEAUB  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCL  |d SXB 
020 |a 0815515138 
020 |a 9780815515135 
020 |a 1591249422  |q (electronic bk.) 
020 |a 9781591249429  |q (electronic bk.) 
020 |a 9780080947167  |q (e-book) 
020 |a 0080947166  |q (e-book) 
020 |a 9780815516002  |q (electronic bk.) 
020 |a 0815516002  |q (electronic bk.) 
024 8 |a 2240562 
035 |a (OCoLC)468750627  |z (OCoLC)64573474  |z (OCoLC)69241972  |z (OCoLC)224377329  |z (OCoLC)281598690  |z (OCoLC)310009759  |z (OCoLC)505070401  |z (OCoLC)647802797  |z (OCoLC)961887431  |z (OCoLC)988679233  |z (OCoLC)999408694  |z (OCoLC)1026443076  |z (OCoLC)1058058799  |z (OCoLC)1065662276  |z (OCoLC)1087309865 
042 |a pcc 
100 1 |a Licari, James J.,  |d 1930-  |1 https://id.oclc.org/worldcat/entity/E39PCjFcjWxggdTwcQ4fPhJvH3 
245 1 0 |a Adhesives technology for electronic applications :  |b materials, processes, reliability /  |c by James J. Licari and Dale W. Swanson. 
260 |a Norwich, NY :  |b William Andrew Pub.,  |c ©2005. 
300 |a 1 online resource (xvi, 459 pages) :  |b illustrations. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Materials and processes for electronic applications series 
504 |a Includes bibliographical references and index. 
505 0 |a Introduction -- Functions and Theory of Adhesives -- Chemistry, Formulation, and Properties of Adhesives -- Adhesive Bonding Properties -- Applications -- Reliability -- Test and Inspection Methods -- Appendix -- Conversion Factors -- Abbreviations and Acronyms -- Index. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Electronics  |x Materials. 
650 0 |a Adhesives. 
650 0 |a Electronic packaging. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Swanson, Dale W. 
776 0 8 |i Print version:  |a Licari, James J., 1930-  |t Adhesives technology for electronic applications.  |d Norwich, NY : William Andrew Pub., ©2005  |z 0815515138  |w (DLC) 2005012647  |w (OCoLC)60321722 
830 0 |a Materials and processes for electronic applications series. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpATEAMPRA/adhesives-technology-for?kpromoter=marc  |y Full text 

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