Electronics reliability and measurement technology : nondestructive evaluation

This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

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Bibliographic Details
Other Authors Heyman, Joseph S.
Format Electronic eBook
LanguageEnglish
Published Park Ridge, N.J., U.S.A. : Noyes Data Corp., ©1988.
Subjects
Integrated circuits > Reliability > Congresses.
Nondestructive testing > Congresses.
Integrated circuits > Testing > Congresses.
elektronické knihy
electronic books
Online AccessFull text
ISBN1591240514
9781591240518
9780815511717
081551171X
9780815516996
0815516991
9780080944685
008094468X
1282002295
9781282002296
9786612002298
6612002298
0815517009
9780815517009
Physical Description1 online resource (xii, 128 pages) : illustrations

Cover

Table of Contents:
  • Measurement Science and Manufacturing Science Research
  • Nondestructive SEM for Surface and Subsurface Wafer Imaging
  • Surface Inspection-Research and Development
  • Wafer Level Reliability for High-Performance VLSI Design
  • Wafer Level Reliability Testing: an Idea Whose Time Has Come
  • Micro-Focus X-Ray Imaging
  • Measurement of Opaque Film Thickness
  • Intelligent Laser Soldering Inspection and Process Control
  • Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits
  • Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement
  • Whole Wafer Scanning Electron Microscopy.

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