Electronics reliability and measurement technology : nondestructive evaluation

This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

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Bibliographic Details
Other Authors: Heyman, Joseph S.
Format: eBook
Language: English
Published: Park Ridge, N.J., U.S.A. : Noyes Data Corp., ©1988.
Subjects:
Integrated circuits > Reliability > Congresses.
Nondestructive testing > Congresses.
Integrated circuits > Testing > Congresses.
elektronické knihy
electronic books
ISBN: 1591240514
9781591240518
9780815511717
081551171X
9780815516996
0815516991
9780080944685
008094468X
1282002295
9781282002296
9786612002298
6612002298
0815517009
9780815517009
Physical Description: 1 online resource (xii, 128 pages) : illustrations

Cover

Table of contents

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007 cr cn|||||||||
008 011107s1988 njua ob 101 0 eng d
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042 |a dlr 
245 0 0 |a Electronics reliability and measurement technology :  |b nondestructive evaluation /  |c edited by Joseph S. Heyman. 
260 |a Park Ridge, N.J., U.S.A. :  |b Noyes Data Corp.,  |c ©1988. 
300 |a 1 online resource (xii, 128 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
500 |a "The Electronics Reliability and Measurement Technology Workshop was held in June 1986 at NASA Langley Research Center"--Page vii 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots. 
504 |a Includes bibliographical references and index. 
505 0 0 |t Measurement Science and Manufacturing Science Research --  |t Nondestructive SEM for Surface and Subsurface Wafer Imaging --  |t Surface Inspection-Research and Development --  |t Wafer Level Reliability for High-Performance VLSI Design --  |t Wafer Level Reliability Testing: an Idea Whose Time Has Come --  |t Micro-Focus X-Ray Imaging --  |t Measurement of Opaque Film Thickness --  |t Intelligent Laser Soldering Inspection and Process Control --  |t Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits --  |t Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement --  |t Whole Wafer Scanning Electron Microscopy. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Integrated circuits  |x Reliability  |v Congresses. 
650 0 |a Nondestructive testing  |v Congresses. 
650 0 |a Integrated circuits  |x Testing  |v Congresses. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Heyman, Joseph S. 
776 0 8 |i Print version:  |t Electronics reliability and measurement technology.  |d Park Ridge, N.J., U.S.A. : Noyes Data Corp., ©1988  |z 081551171X  |w (DLC) 88025395 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpERMTNE02/electronics-reliability-and?kpromoter=marc  |y Full text 

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