RF and microwave microelectronics packaging II

• Other Authors: Kuang, Ken (Editor), Sturdivant, Rick (Editor)
• Format: Electronic eBook
• Language: English
• Published: Cham, Switzerland : Springer, 2017.
• Subjects: Microelectronic packaging.; elektronické knihy; electronic books
• ISBN: 9783319516974; 9783319516967
• Physical Description: 1 online resource (xii, 172 pages) : illustrations (some color)

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...