3D microelectronic packaging : from fundamentals to applications

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the...

Full description

Saved in:
Bibliographic Details
Other Authors Li, Yan (Editor), Goyal, Deepak (Editor)
Format Electronic eBook
LanguageEnglish
Published Cham, Switzerland : Springer, [2017]
SeriesSpringer series in advanced microelectronics ; 57.
Subjects
Microelectronics > Packaging.
elektronické knihy
electronic books
Online AccessFull text
ISBN9783319445861
9783319445847
ISSN1437-0387 ;
Physical Description1 online resource (viii, 463 pages) : illustrations

Cover

Table of Contents:
  • Introduction to 3D Microelectronic Packaging
  • 3D packaging architecture and assembly process design
  • Materials and Processing of TSV
  • Microstructural and Reliability Issues of TSV
  • Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging
  • Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages
  • Fundamentals of solder alloys in 3D packaging
  • Fundamentals of Electromigration in interconnects of 3D packages
  • Fundamentals of heat dissipation in 3D IC packaging
  • Fundamentals of advanced materials and processes in organic substrate technology
  • Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization
  • Processing and Reliability of Solder Interconnections in Stacked Packaging
  • Interconnect Quality and Reliability of 3D Packaging
  • Fault isolation and failure analysis of 3D packaging.

Similar Items