Carbon nanotubes for interconnects : process, design and applications
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...
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| Other Authors | , , |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Switzerland :
Springer,
[2016]
|
| Subjects | |
| Online Access | Full text |
| ISBN | 9783319297460 9783319297446 |
| Physical Description | 1 online resource (xii, 333 pages) : illustrations (some color) |
Cover
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| 245 | 0 | 0 | |a Carbon nanotubes for interconnects : |b process, design and applications / |c Aida Todri-Sanial, Jean Dijon, Antonio Maffucci, editors. |
| 264 | 1 | |a Switzerland : |b Springer, |c [2016] | |
| 264 | 4 | |c ©2017 | |
| 300 | |a 1 online resource (xii, 333 pages) : |b illustrations (some color) | ||
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| 520 | |a This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.- Resumé vydavatel | ||
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| 700 | 1 | |a To-Sanial, Aida, |e editor. | |
| 700 | 1 | |a Dijon, Jean, |e editor. | |
| 700 | 1 | |a Maffucci, Antonio, |e editor. | |
| 776 | 0 | 8 | |i Erscheint auch als: |n Druck-Ausgabe |a Todri-Sanial, Aida. Carbon Nanotubes for Interconnects . |t Process, Design and Applications |
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