Carbon nanotubes for interconnects : process, design and applications

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...

Full description

Saved in:
Bibliographic Details
Other Authors: To-Sanial, Aida, (Editor), Dijon, Jean, (Editor), Maffucci, Antonio, (Editor)
Format: eBook
Language: English
Published: Switzerland : Springer, [2016]
Subjects:
integrované obvody
mikroprocesory
elektronické obvody
uhlíkové materiály
nanotrubky
integrated circuits
microprocessors
electronic circuits
carbon materials
nanotubes
elektronické knihy
sborníky
electronic books
papers of several authors
ISBN: 9783319297460
9783319297446
Physical Description: 1 online resource (xii, 333 pages) : illustrations (some color)

Cover

Table of contents

LEADER 03915cam a2200637Ii 4500
001 99213
003 CZ-ZlUTB
005 20240914111704.0
006 m o d
007 cr cnu|||unuuu
008 160712t20162017sz a fo 000 0 eng d
999 |c 99213  |d 99213 
020 |a 9783319297460  |q (electronic bk.) 
020 |z 9783319297446  |q (print) 
035 |a (OCoLC)953455679 
040 |a N$T  |b eng  |e rda  |e pn  |c N$T  |d YDXCP  |d IDEBK  |d EBLCP  |d GW5XE  |d N$T  |d OCLCF  |d DEBBG  |d IDB  |d UAB  |d IOG  |d ESU  |d Z5A  |d JBG  |d IAD  |d ICW  |d ICN  |d OTZ  |d OCLCQ  |d U3W  |d CAUOI  |d OCLCQ  |d KSU  |d OCLCQ  |d UKMGB  |d UKAHL  |d OCLCQ 
072 7 |a 621.38  |x Elektronika  |2 Konspekt  |9 19 
080 |a 621.3.049.77  |2 MRF 
080 |a 004.318  |2 MRF 
080 |a 621.38.011.7  |2 MRF 
080 |a 620.2-032.3  |2 MRF 
080 |a 620.2-022.532-462  |2 MRF 
080 |a (0.034.2:08)  |2 MRF 
080 |a (082)  |2 MRF 
245 0 0 |a Carbon nanotubes for interconnects :  |b process, design and applications /  |c Aida Todri-Sanial, Jean Dijon, Antonio Maffucci, editors. 
264 1 |a Switzerland :  |b Springer,  |c [2016] 
264 4 |c ©2017 
300 |a 1 online resource (xii, 333 pages) :  |b illustrations (some color) 
336 |a text  |b txt  |2 rdacontent 
337 |a počítač  |b c  |2 rdamedia 
338 |a online zdroj  |b cr  |2 rdacarrier 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.- Resumé vydavatel 
590 |a SpringerLink  |b Springer Complete eBooks 
650 0 7 |a integrované obvody  |2 czenas  |7 ph114781 
650 0 7 |a mikroprocesory  |2 czenas  |7 ph115311 
650 0 7 |a elektronické obvody  |2 czenas  |7 ph114450 
650 0 7 |a uhlíkové materiály  |2 czenas  |7 ph138298 
650 0 7 |a nanotrubky  |2 czenas  |7 ph615515 
650 0 9 |a integrated circuits  |2 eczenas 
650 0 9 |a microprocessors  |2 eczenas 
650 0 9 |a electronic circuits  |2 eczenas 
650 0 9 |a carbon materials  |2 eczenas 
650 0 9 |a nanotubes  |2 eczenas 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 7 |a sborníky  |7 fd163935  |2 czenas 
655 9 |a electronic books  |2 eczenas 
655 9 |a papers of several authors  |2 eczenas 
700 1 |a To-Sanial, Aida,  |e editor. 
700 1 |a Dijon, Jean,  |e editor. 
700 1 |a Maffucci, Antonio,  |e editor. 
776 0 8 |i Erscheint auch als:  |n Druck-Ausgabe  |a Todri-Sanial, Aida. Carbon Nanotubes for Interconnects .  |t Process, Design and Applications 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://link.springer.com/10.1007/978-3-319-29746-0  |y Plný text 
942 |2 udc 
992 |c NTK-SpringerENG 
993 |x NEPOSILAT  |y EIZ 

Similar Items