Carbon nanotubes for interconnects : process, design and applications

• Other Authors: To-Sanial, Aida, (Editor), Dijon, Jean, (Editor), Maffucci, Antonio, (Editor)
• Format: eBook
• Language: English
• Published: Switzerland : Springer, [2016]
• Subjects: integrované obvody; mikroprocesory; elektronické obvody; uhlíkové materiály; nanotrubky; integrated circuits; microprocessors; electronic circuits; carbon materials; nanotubes; elektronické knihy; sborníky; electronic books; papers of several authors
• ISBN: 9783319297460; 9783319297446
• Physical Description: 1 online resource (xii, 333 pages) : illustrations (some color)
• Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.- Resumé vydavatel