Holdings: Encapsulation technologies for electronic applications

Encapsulation technologies for electronic applications

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Bibliographic Details
Main Authors:	Ardebili, Haleh (Author), Zhang, Jiawei (Author), Pecht, Michael, 1952- (Author)
Format:	Book
Language:	English
Published:	Oxford : William Andrew, [2019]
Edition:	Second edition
Series:	Materials and processes for electronic application series
Subjects:	elektronika spolehlivost (technika) electronics reliability (engineering) encapsulation technologies kolektivní monografie collective monographs
ISBN:	978-0-12-811978-5
Physical Description:	x, 498 stran : ilustrace ; 23 cm

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Status	Description	Location	Call Number
Status Long term loan – Due : 21.12.2028 Recall This	Description Location	FAI	Call Number	62/ARDEBILI,H.

Status	Description	Location	Call Number
Long term loan - Due : 21.12.2028 Recall This		FAI	62/ARDEBILI,H.