Encapsulation technologies for electronic applications

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Bibliographic Details
Main Authors	Ardebili, Haleh (Author), Zhang, Jiawei (Author), Pecht, Michael, 1952- (Author)
Format	Book
Language	English
Published	Oxford : William Andrew, [2019]
Edition	Second edition
Series	Materials and processes for electronic application series
Subjects	elektronika spolehlivost (technika) electronics reliability (engineering) encapsulation technologies kolektivní monografie collective monographs
ISBN	978-0-12-811978-5
Physical Description	x, 498 stran : ilustrace ; 23 cm

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Holdings details from Knihovna UTB
Status	More Information	Location	Call Number
Status Long term loan – Due: 21.12.2028	More Information	Location FAI	Call Number 62/ARDEBILI,H.