Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers

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Bibliographic Details
Main Author: Franke, Jörg, Dipl.-Ing., (Author)
Format: eBook
Language: English
Published: Munich ; Cincinnati, OH : Hanser, [2014]
Subjects:
Interconnects (Integrated circuit technology) > Design and construction.
Injection molding of plastics.
elektronické knihy
electronic books
ISBN: 9781569905524
9781680157277
9781569905517
Physical Description: 1 online zdroj (xii, 356 pages) : color illustrations

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Table of contents

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020 |a 9781569905524  |q (ebook) 
020 |a 9781680157277  |q (ebook) 
020 |z 9781569905517 
035 |a (OCoLC)891586550 
040 |a UIU  |b eng  |e rda  |e pn  |c UIU  |d UIU  |d KNOVL  |d OCLCQ  |d OCLCO  |d ZCU 
041 1 |a eng  |h ger 
100 1 |a Franke, Jörg,  |c Dipl.-Ing.,  |e author. 
240 1 0 |a Räumliche elektronische Baugruppen (3D-MID).  |l English 
245 1 0 |a Three-dimensional molded interconnect devices (3D-MID) :  |b materials, Manufacturing, assembly, and applications for injection molded circuit carriers /  |c Jörg Franke. 
264 1 |a Munich ;  |a Cincinnati, OH :  |b Hanser,  |c [2014] 
264 4 |c ©2014 
300 |a 1 online zdroj (xii, 356 pages) :  |b color illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a počítač  |b c  |2 rdamedia 
338 |a online zdroj  |b cr  |2 rdacarrier 
500 |a Translated from the German. 
504 |a Includes bibliographical references and index. 
590 |a Knovel Library  |b ACADEMIC - Plastics & Rubber 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity 
650 0 |a Interconnects (Integrated circuit technology)  |x Design and construction. 
650 0 |a Injection molding of plastics. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
776 0 8 |i Print version:  |z 9781569905517  |w (DLC) 2014006403  |w (OCoLC)876833155 
856 4 0 |u https://proxy.k.utb.cz/login?url=http://app.knovel.com/hotlink/toc/id:kpTDMIDDM6/threedimensional_molded_interconnect_devices_3dmid__materials_manufacturing_assembly_and_applications_for_injection_molded_circuit_carriers  |y Plný text 
992 |a BK  |c KNOVEL 
999 |c 82627  |d 82627 
993 |x NEPOSILAT  |y EIZ 

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