Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers
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| Main Author | |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Munich ; Cincinnati, OH :
Hanser,
[2014]
|
| Subjects | |
| Online Access | Full text |
| ISBN | 9781569905524 9781680157277 9781569905517 |
| Physical Description | 1 online zdroj (xii, 356 pages) : color illustrations |
Cover
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| 020 | |a 9781569905524 |q (ebook) | ||
| 020 | |a 9781680157277 |q (ebook) | ||
| 020 | |z 9781569905517 | ||
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| 041 | 1 | |a eng |h ger | |
| 100 | 1 | |a Franke, Jörg, |c Dipl.-Ing., |e author. | |
| 240 | 1 | 0 | |a Räumliche elektronische Baugruppen (3D-MID). |l English |
| 245 | 1 | 0 | |a Three-dimensional molded interconnect devices (3D-MID) : |b materials, Manufacturing, assembly, and applications for injection molded circuit carriers / |c Jörg Franke. |
| 264 | 1 | |a Munich ; |a Cincinnati, OH : |b Hanser, |c [2014] | |
| 264 | 4 | |c ©2014 | |
| 300 | |a 1 online zdroj (xii, 356 pages) : |b color illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a počítač |b c |2 rdamedia | ||
| 338 | |a online zdroj |b cr |2 rdacarrier | ||
| 500 | |a Translated from the German. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 590 | |a Knovel Library |b ACADEMIC - Plastics & Rubber | ||
| 506 | |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity | ||
| 650 | 0 | |a Interconnects (Integrated circuit technology) |x Design and construction. | |
| 650 | 0 | |a Injection molding of plastics. | |
| 655 | 7 | |a elektronické knihy |7 fd186907 |2 czenas | |
| 655 | 9 | |a electronic books |2 eczenas | |
| 776 | 0 | 8 | |i Print version: |z 9781569905517 |w (DLC) 2014006403 |w (OCoLC)876833155 |
| 856 | 4 | 0 | |u https://proxy.k.utb.cz/login?url=http://app.knovel.com/hotlink/toc/id:kpTDMIDDM6/threedimensional_molded_interconnect_devices_3dmid__materials_manufacturing_assembly_and_applications_for_injection_molded_circuit_carriers |
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