Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers

Saved in:
Bibliographic Details
Main Author Franke, Jörg, Dipl.-Ing (Author)
Format Electronic eBook
LanguageEnglish
Published Munich ; Cincinnati, OH : Hanser, [2014]
Subjects
Interconnects (Integrated circuit technology) > Design and construction.
Injection molding of plastics.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781569905524
9781680157277
9781569905517
Physical Description1 online zdroj (xii, 356 pages) : color illustrations

Cover

More Information
Item Description:Translated from the German.
Bibliography:Includes bibliographical references and index.
ISBN:9781569905524
9781680157277
9781569905517
Access:Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity
Physical Description:1 online zdroj (xii, 356 pages) : color illustrations

Similar Items