Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010

The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future...

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Bibliographic Details
Corporate Author: International Conference on Components, Packaging and Manufacturing Technology Sanya Shi, China)
Other Authors: Wu, Yanwen. (Editor)
Format: eBook
Language: English
Published: Switzerland : Trans Tech Publications, 2011.
Series: Key engineering materials ; v. 460-461.
Subjects:
Electronic apparatus and appliances > Congresses.
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.
Manufacturing processes > Congresses.
elektronické knihy
electronic books
ISBN: 9781613446713
9780878492138
9783038134800
Physical Description: 1 online zdroj : ill.

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Table of contents

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001 80421
003 CZ ZlUTB
005 20240911220130.0
006 m o d
007 cr |n
008 110225s2011 sz a fsb 101 0 eng d
020 |a 9781613446713  |q (ebook) 
020 |z 9780878492138 
020 |a 9783038134800 
035 |a (OCoLC)703876000 
040 |a MUU  |b eng  |c MUU  |d CUY  |d OCLCQ  |d KNOVL  |d E7B  |d OCLCQ  |d KNOVL  |d OCLCO  |d EBLCP  |d KNOVL  |d DEBSZ  |d OCLCO 
111 2 |a International Conference on Components, Packaging and Manufacturing Technology  |d (2010 :  |c Sanya Shi, China) 
245 1 0 |a Components, packaging and manufacturing technology  |h [elektronický zdroj] :  |b selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010 /  |c edited by Yanwen Wu. 
246 3 0 |a 2010 International Conference on Components, Packaging and Manufacturing Technology 
246 3 0 |a ICCPMT 2010 
260 |a Switzerland :  |b Trans Tech Publications,  |c 2011. 
300 |a 1 online zdroj :  |b ill. 
490 1 |a Key Engineering Materials,  |x 1662-9795 ;  |v Vols. 460 - 461 
504 |a Includes bibliographical references and index. 
520 |a The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology. This work thus constitutes a handy guide to current thinking in the field. Review from Book News Inc.: Nearly 150 selected and peer-reviewed papers discuss first advanced measurement, test, and information technology; then components, packaging, and manufacturing technology. The topics include exploring the structure of the crisis management team, the mutual information model of adaptive waveform design, counter-measures of electronic business development for Chinese travel companies, an improved attack-resistant collaborative filtering algorithm, analyzing the characteristics of textile materials based on pre-judgement mechanisms, applying chaos particle swarm optimized neural networks for evaluating credit risk, next-day load forecasting using local temperature-sensitive information, and applying data mining technology in mechanical fault diagnosis. 
590 |a Knovel Library  |b ACADEMIC - Manufacturing Engineering 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity 
650 0 |a Electronic apparatus and appliances  |v Congresses. 
650 0 |a Electronic packaging  |v Congresses. 
650 0 |a Microelectronic packaging  |v Congresses. 
650 0 |a Manufacturing processes  |v Congresses. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Wu, Yanwen.  |4 edt 
830 0 |a Key engineering materials ;  |v v. 460-461. 
856 4 0 |u https://proxy.k.utb.cz/login?url=http://app.knovel.com/hotlink/toc/id:kpCPMT0008/components_packaging_and_manufacturing_technology  |y Plný text 
992 |a BK  |c KNOVEL 
999 |c 80421  |d 80421 
993 |x NEPOSILAT  |y EIZ 

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