Reliability and failure of electronic materials and devices

"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus...

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Bibliographic Details
Main Author: Ohring, Milton, 1936-
Other Authors: Kasprzak, Lucian.
Format: eBook
Language: English
Published: Amsterdam ; Boston : Academic Press is an imprint of Elsevier, 2014.
Edition: Second edition.
Subjects:
ISBN: 9780080575520
9780120885749
Physical Description: 1 online zdroj.

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Table of contents

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020 |a 9780080575520  |q (ebook) 
020 |z 9780120885749 
035 |a (OCoLC)893439517 
040 |a N$T  |b eng  |e rda  |e pn  |c N$T  |d YDXCP  |d OCLCQ  |d OPELS  |d OCLCF  |d KNOVL 
100 1 |a Ohring, Milton,  |d 1936- 
245 1 0 |a Reliability and failure of electronic materials and devices /  |c Milton Ohring, Lucian Kasprzak. 
250 |a Second edition. 
264 1 |a Amsterdam ;  |a Boston :  |b Academic Press is an imprint of Elsevier,  |c 2014. 
300 |a 1 online zdroj. 
336 |a text  |b txt  |2 rdacontent 
337 |a počítač  |b c  |2 rdamedia 
338 |a online zdroj  |b cr  |2 rdacarrier 
500 |a Includes index. 
520 |a "Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"--  |c Provided by publisher. 
500 |a Machine generated contents note: CH 1 An Overview of Electronic Devices and Their Reliability CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated CH 3 Defects, Contamination and Yield CH 4 The Mathematics of Failure and Reliability CH 5 Mass Transport-Induced Failure Ch 6 Electronic Charge-Induced Damage CH 7 Environmental Damage to Electronic Products CH 8 Packaging Materials, Processes, and Stresses CH 9 Degradation of Contacts and Packages CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices CH 11 Characterization and Failure Analysis of Material, Devices and Packages CH 12 Future Directions and Reliability Issues. 
590 |a Knovel Library  |b ACADEMIC - Electronics & Semiconductors 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity 
650 0 |a Electronic apparatus and appliances  |x Reliability. 
650 0 |a System failures (Engineering) 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Kasprzak, Lucian. 
776 0 8 |i Print version:  |a Ohring, Milton, 1936-  |t Reliability and failure of electronic materials and devices.  |b Second edition  |z 9780120885749  |w (DLC) 2014031265  |w (OCoLC)887187586 
856 4 0 |u https://proxy.k.utb.cz/login?url=http://app.knovel.com/hotlink/toc/id:kpRFEMDE06/reliability_and_failure_of_electronic_materials_and_devices_2nd_edition  |y Plný text 
992 |a BK  |c KNOVEL 
999 |c 79059  |d 79059 
993 |x NEPOSILAT  |y EIZ