Introduction to semiconductor technology

Integrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technolgies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs toda...

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Bibliographic Details
Main Author: Xiao, Hong.
Corporate Author: Society of Photo-optical Instrumentation Engineers.
Format: eBook
Language: English
Published: Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) : SPIE, 2012.
Edition: 2nd ed.
Series: SPIE monograph ; PM220.
SPIE Digital Library.
Subjects:
Integrated circuits > Design and construction.
Semiconductors > Design and construction.
Semiconductor industry.
elektronické knihy
electronic books
ISBN: 9780819490933
9781628701043
9780819490926
Physical Description: 1 online zdroj (xix, 656 pages) : illustrations, digital file.

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001 79011
003 CZ ZlUTB
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007 cr |n
008 120719s2012 waua fsb 000 0 eng d
020 |a 9780819490933  |q (ebook) 
020 |a 9781628701043  |q (ebook) 
020 |z 9780819490926 
024 7 |a 10.1117/3.924283  |2 doi 
035 |a (OCoLC)801513077 
040 |a SPIES  |b eng  |e pn  |c SPIES  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCA  |d OCLCQ  |d KNOVL  |d OCLCF  |d DEBSZ  |d ZCU  |d OCLCQ  |d OCLCO  |d N$T  |d KNOVL  |d YDXCP 
100 1 |a Xiao, Hong. 
245 1 0 |a Introduction to semiconductor technology  |h [elektronický zdroj] /  |c Hong Xiao. 
250 |a 2nd ed. 
260 |a Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) :  |b SPIE,  |c 2012. 
300 |a 1 online zdroj (xix, 656 pages) :  |b illustrations, digital file. 
336 |a text  |b txt  |2 rdacontent 
337 |a počítač  |b c  |2 rdamedia 
338 |a online zdroj  |b cr  |2 rdacarrier 
490 1 |a SPIE Press monograph ;  |v PM220 
500 |a "SPIE Digital Library."--Website. 
504 |a Includes bibliographical references. 
505 0 |a Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary. 
520 |a Integrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technolgies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs today. A history of the field is included as context for modern practictioners. The second edition covers advancements made in the past decade and adds new illustrations. 
590 |a Knovel Library  |b ACADEMIC - Electronics & Semiconductors 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity 
650 0 |a Integrated circuits  |x Design and construction. 
650 0 |a Semiconductors  |x Design and construction. 
650 0 |a Semiconductor industry. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
710 2 |a Society of Photo-optical Instrumentation Engineers. 
776 0 8 |i Print version:  |z 081949092X  |z 9780819490926  |w (DLC) 2012013231 
830 0 |a SPIE monograph ;  |v PM220. 
830 0 |a SPIE Digital Library. 
856 4 0 |u https://proxy.k.utb.cz/login?url=http://app.knovel.com/hotlink/toc/id:kpISTE0002/introduction_to_semiconductor_manufacturing_technology_2nd_edition  |y Plný text 
992 |a BK  |c KNOVEL 
999 |c 79011  |d 79011 

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