Advances in CMP/polishing technologies for the manufacture of electronic devices

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.

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Bibliographic Details
Other Authors: Doi, Toshiro K., 1947-, Marinescu, Ioan D., Kurokawa, Syuhei.
Format: eBook
Language: English
Published: Oxford : Elsevier, 2012.
Edition: 1st ed.
Subjects:
Grinding and polishing.
elektronické knihy
electronic books
ISBN: 9781437778601
9781437778595
Physical Description: 1 online zdroj (xii, 317 p.) ill., col. ports.

Cover

Table of contents

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245 0 0 |a Advances in CMP/polishing technologies for the manufacture of electronic devices  |h [elektronický zdroj] /  |c edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa. 
250 |a 1st ed. 
260 |a Oxford :  |b Elsevier,  |c 2012. 
300 |a 1 online zdroj (xii, 317 p.)  |b ill., col. ports. 
504 |a Includes bibliographical references and index. 
520 3 |a CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover. 
590 |a Knovel Library  |b ACADEMIC - Electronics & Semiconductors 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity 
650 0 |a Grinding and polishing. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Doi, Toshiro K.,  |d 1947- 
700 1 |a Marinescu, Ioan D. 
700 1 |a Kurokawa, Syuhei. 
776 0 8 |i Print version:  |t Advances in CMP/polishing technologies for the manufacture of electronic devices.  |b 1st ed.  |d Oxford ; Waltham, MA : Elsevier, 2012  |z 9781437778595  |w (DLC) 2012359712  |w (OCoLC)740631119 
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999 |c 79005  |d 79005 
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