Advances in CMP/polishing technologies for the manufacture of electronic devices

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Bibliographic Details
Other Authors Doi, Toshiro K., 1947-, Marinescu, Ioan D., Kurokawa, Syuhei
Format eBook
LanguageEnglish
Published Oxford : Elsevier, 2012.
Edition1st ed.
Subjects
Grinding and polishing.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781437778601
9781437778595
Physical Description1 online zdroj (xii, 317 p.) ill., col. ports.

Cover

More Information
Abstract:CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
Bibliography:Includes bibliographical references and index.
ISBN:9781437778601
9781437778595
Access:Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity
Physical Description:1 online zdroj (xii, 317 p.) ill., col. ports.

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