Description: Advances in CMP/polishing technologies for the manufacture of electronic devices

Advances in CMP/polishing technologies for the manufacture of electronic devices

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.

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Bibliographic Details
Other Authors:	Doi, Toshiro K., 1947-, Marinescu, Ioan D., Kurokawa, Syuhei.
Format:	eBook
Language:	English
Published:	Oxford : Elsevier, 2012.
Edition:	1st ed.
Subjects:	Grinding and polishing. elektronické knihy electronic books
ISBN:	9781437778601 9781437778595
Physical Description:	1 online zdroj (xii, 317 p.) ill., col. ports.

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Description
Summary:	CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
Bibliography:	Includes bibliographical references and index.
ISBN:	9781437778601 9781437778595
Access:	Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity