Handbook of multilevel metallization for integrated circuits materials, technology, and applications

It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These tea...

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Bibliographic Details
Other Authors: Wilson, Syd R., Tracy, Clarence J., Freeman, John L.
Format: eBook
Language: English
Published: Park Ridge, N.J. : Noyes Publications, c1993.
Series: Materials science and process technology series. Electronic materials and process technology.
Subjects:
Integrated circuits > Design and construction.
Metallizing.
elektronické knihy
electronic books
ISBN: 9781591243649
9780815513407
9780815517603
Physical Description: 1 online zdroj (xxiii, 887 p.) : ill.

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245 0 0 |a Handbook of multilevel metallization for integrated circuits  |h [elektronický zdroj] :  |b materials, technology, and applications /  |c edited by Syd R. Wilson and Clarence J. Tracy, John L. Freeman, Jr. 
260 |a Park Ridge, N.J. :  |b Noyes Publications,  |c c1993. 
300 |a 1 online zdroj (xxiii, 887 p.) :  |b ill. 
336 |a text  |b txt  |2 rdacontent 
337 |a počítač  |b c  |2 rdamedia 
338 |a online zdroj  |b cr  |2 rdacarrier 
490 1 |a Materials science and process technology series. Electronic materials and process technology 
504 |a Includes bibliographical references and index. 
505 0 |a 12. Electronic Packaging and Its Influences On Integrated Circuit Design and Processing / Harry K. Charles, Jr. and G. Donald Wagner -- 13. Future Interconnect Systems / S. Simon Wong. 
520 |a It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules. 
520 8 |a MLM teams are usually composed of unit process specialists and it is difficult for them to become generalists to solve the device, design, chemical, materials science, and analysis problems which are encountered. The engineers comprising these teams have been forced to accumulate and read large numbers of publications from each topical area to obtain a reasonably complete understanding of the numerous topics. 
520 8 |a The Handbook of Multilevel Metallization for Integrated Circuits answers this need by pulling together in one volume a thorough technical summary of each of the key areas that make up a multilevel metal system. Properly included are associated design, analysis, materials, and manufacturing topics. The book serves three purposes: (1) It is a good learning tool for the engineer newly assigned to work in metallization. 
520 8 |a All important aspects of the fully integrated process are discussed in sufficient depth such that no additional literature searches are needed. (2) It serves as a reference text for any MLM engineer, new or experienced, who needs a refresher about the specifics of a concept or process. (3) For someone who wants to further specialize in one topical area, an extensive listing of references has been provided to simplify more in-depth study. 
590 |a Knovel Library  |b ACADEMIC - Electronics & Semiconductors 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity 
650 0 |a Integrated circuits  |x Design and construction. 
650 0 |a Metallizing. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Wilson, Syd R. 
700 1 |a Tracy, Clarence J. 
700 1 |a Freeman, John L. 
776 0 8 |i Print version:  |t Handbook of multilevel metallization for integrated circuits.  |d Park Ridge, N.J. : Noyes Publications, c1993  |z 0815513402  |w (DLC) 93026689 
830 0 |a Materials science and process technology series.  |p Electronic materials and process technology. 
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992 |a BK  |c KNOVEL 
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