Electronics reliability and measurement technology nondestructive evaluation

This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

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Bibliographic Details
Other Authors Heyman, Joseph S.
Format Electronic eBook
LanguageEnglish
Published Park Ridge, N.J., U.S.A. : Noyes Data Corp., ©1988.
Subjects
Integrated circuits > Reliability > Congresses.
Nondestructive testing > Congresses.
Integrated circuits > Testing > Congresses.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781591240518
9780815511717
9780815516996
9780815517009
9780080944685
Physical Description1 online zdroj (xii, 128 pages) : illustrations

Cover

Table of Contents:
  • Measurement Science and Manufacturing Science Research
  • Nondestructive SEM for Surface and Subsurface Wafer Imaging
  • Surface Inspection-Research and Development
  • Wafer Level Reliability for High-Performance VLSI Design
  • Wafer Level Reliability Testing: an Idea Whose Time Has Come
  • Micro-Focus X-Ray Imaging
  • Measurement of Opaque Film Thickness
  • Intelligent Laser Soldering Inspection and Process Control
  • Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits
  • Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement
  • Whole Wafer Scanning Electron Microscopy.

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