Electronics reliability and measurement technology nondestructive evaluation

This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

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Bibliographic Details
Other Authors: Heyman, Joseph S.
Format: eBook
Language: English
Published: Park Ridge, N.J., U.S.A. : Noyes Data Corp., ©1988.
Subjects:
Integrated circuits > Reliability > Congresses.
Nondestructive testing > Congresses.
Integrated circuits > Testing > Congresses.
elektronické knihy
electronic books
ISBN: 9781591240518
9780815511717
9780815516996
9780815517009
9780080944685
Physical Description: 1 online zdroj (xii, 128 pages) : illustrations

Cover

Table of contents

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245 0 0 |a Electronics reliability and measurement technology  |h [elektronický zdroj] :  |b nondestructive evaluation /  |c edited by Joseph S. Heyman. 
260 |a Park Ridge, N.J., U.S.A. :  |b Noyes Data Corp.,  |c ©1988. 
300 |a 1 online zdroj (xii, 128 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a počítač  |b c  |2 rdamedia 
338 |a online zdroj  |b cr  |2 rdacarrier 
500 |a "The Electronics Reliability and Measurement Technology Workshop was held in June 1986 at NASA Langley Research Center"--Page vii. 
520 |a This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots. 
504 |a Includes bibliographical references and index. 
505 0 0 |t Measurement Science and Manufacturing Science Research --  |t Nondestructive SEM for Surface and Subsurface Wafer Imaging --  |t Surface Inspection-Research and Development --  |t Wafer Level Reliability for High-Performance VLSI Design --  |t Wafer Level Reliability Testing: an Idea Whose Time Has Come --  |t Micro-Focus X-Ray Imaging --  |t Measurement of Opaque Film Thickness --  |t Intelligent Laser Soldering Inspection and Process Control --  |t Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits --  |t Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement --  |t Whole Wafer Scanning Electron Microscopy. 
590 |a Knovel Library  |b ACADEMIC - Electronics & Semiconductors 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity 
650 0 |a Integrated circuits  |x Reliability  |v Congresses. 
650 0 |a Nondestructive testing  |v Congresses. 
650 0 |a Integrated circuits  |x Testing  |v Congresses. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Heyman, Joseph S. 
776 0 8 |i Print version:  |t Electronics reliability and measurement technology.  |d Park Ridge, N.J., U.S.A. : Noyes Data Corp., ©1988  |z 081551171X  |w (DLC) 88025395 
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992 |a BK  |c KNOVEL 
999 |c 78839  |d 78839 
993 |x NEPOSILAT  |y EIZ 

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