Handbook of VLSI microlithography principles, technology, and applications

This handbook gives readers a look at the technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings - including optical lithography, electron beam, ion beam, and X-ray lithography. The book's main theme is the specia...

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Bibliographic Details
Other Authors: Helbert, John N.
Format: eBook
Language: English
Published: Park Ridge, N.J. : Norwich, N.Y. : Noyes Publications ; William Andrew Pub., c2001.
Edition: 2nd ed.
Series: Materials science and process technology series. Electronic materials and process technology.
Subjects:
Integrated circuits > Very large scale integration.
Microlithography.
elektronické knihy
electronic books
ISBN: 9781591242758
9780815514442
9780815517795
9780815517801
Physical Description: 1 online zdroj (xxi, 1001 p.) : ill.

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020 |a 9780815517795  |q (ebook) 
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245 0 0 |a Handbook of VLSI microlithography  |h [elektronický zdroj] :  |b principles, technology, and applications /  |c edited by John N. Helbert. 
250 |a 2nd ed. 
260 |a Park Ridge, N.J. :  |b Noyes Publications ;  |a Norwich, N.Y. :  |b William Andrew Pub.,  |c c2001. 
300 |a 1 online zdroj (xxi, 1001 p.) :  |b ill. 
336 |a text  |b txt  |2 rdacontent 
337 |a počítač  |b c  |2 rdamedia 
338 |a online zdroj  |b cr  |2 rdacarrier 
490 1 |a Materials science and process technology series. Electronic materials and process technology 
520 |a This handbook gives readers a look at the technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings - including optical lithography, electron beam, ion beam, and X-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge, and pattern feature dimension control. The book's explanation of resist and resist process equipment technology describes the relationship between the resist process and equipment parameters. The basics of resist technology are also covered - including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. 
504 |a Includes bibliographical references and index. 
505 0 |a Issues and Trends Affecting Lithography Tool Selection Strategy -- Resist Technology: Design, Processing and Applications -- Lithography Process Monitoring and Defect Detection -- Techniques and Tools for Photo Metrology -- Techniques and Tools for Optical Lithography -- Microlithography Tool Automation -- Electron Beam ULSI Applications -- Rational Vibration and Structural Dynamics for Lithographic Tool Installations -- Applications of Ion Microbeam Lithography and Direct Processing -- X-Ray Lithography. 
590 |a Knovel Library  |b ACADEMIC - Electronics & Semiconductors 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity 
650 0 |a Integrated circuits  |x Very large scale integration. 
650 0 |a Microlithography. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Helbert, John N. 
776 0 8 |i Print version:  |t Handbook of VLSI microlithography.  |b 2nd ed.  |d Park Ridge, N.J. : Noyes Publications ; Norwich, N.Y. : William Andrew Pub., c2001  |z 0815514441  |w (DLC) 00028173  |w (OCoLC)43591143 
830 0 |a Materials science and process technology series.  |p Electronic materials and process technology. 
856 4 0 |u https://proxy.k.utb.cz/login?url=http://app.knovel.com/hotlink/toc/id:kpHVLSIMP1/handbook_of_vlsi_microlithography__principles_technology_and_applications_2nd_edition  |y Plný text 
992 |a BK  |c KNOVEL 
999 |c 78829  |d 78829 

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