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Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers

by Franke, Jörg, 1964-
Year of Publication 2014

Book

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Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers

by Franke, Jörg, Dipl.-Ing
Year of Publication 2014

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Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers

by Franke, Jörg (Prof. Dr.-Ing.)
Year of Publication 2014

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Wireless charging technology and the future of electric transportation

by Sŏ, In-su, Cho, Dong-Ho, Franke, Jorg, Hong, Soon-Man, Lee, Byung Song, Miller, John M., 1949-, Risch, Florian, Shinohara, Naoki, 1968-, Turki, Faical
Year of Publication 2015

Full text

Electronic eBook

Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers

Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers

Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers

Wireless charging technology and the future of electric transportation

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