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Franke, Jörg, 1964-
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Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers
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Franke, Jörg, 1964
-
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2014
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Related Subjects
electronic circuits
elektronické obvody
injection moulding
integrated circuits
integrované obvody
vstřikování plastů
