Provably good and practically efficient algorithms for CMP
To reduce chip-scale topography variation in chemical mechanical polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous researches formulated the dummy fill problem as a standard linear program (LP). However, solving the huge linear program formed by re...
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| Published in | 2009 46th ACM/IEEE Design Automation Conference pp. 539 - 544 |
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| Main Authors | , , , , |
| Format | Conference Proceeding |
| Language | English |
| Published |
IEEE
01.07.2009
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| Subjects | |
| Online Access | Get full text |
| ISBN | 9781605584973 1605584975 |
| ISSN | 0738-100X |
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| Summary: | To reduce chip-scale topography variation in chemical mechanical polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous researches formulated the dummy fill problem as a standard linear program (LP). However, solving the huge linear program formed by real-life designs is very expensive and has become the hurdle in deploying the technology. Even though there exist efficient heuristics, their performance cannot be guaranteed. In this paper, we develop a dummy fill algorithm that is both efficient and with provably good performance. It is based on a fully polynomial time approximation scheme [Fleischer, 2004 ] for covering LP problems. Furthermore, based on the approximation algorithm, we also propose a new greedy iterative algorithm to achieve high quality solutions more efficiently than previous Monte-Carlo based heuristic methods. Experimental results demonstrate the effectiveness and efficiency of our algorithms. |
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| ISBN: | 9781605584973 1605584975 |
| ISSN: | 0738-100X |