Method for producing glass substrate and glass substrate
The present invention is aimed to provide a method for producing a glass substrate with a thickness of not more than 200 μm, which is satisfied with the quality required for a substrate on which a thin-film electric circuit is formed, and a sheet glass substrate obtained according to this method. Th...
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Format | Patent |
Language | English |
Published |
01.12.2015
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Abstract | The present invention is aimed to provide a method for producing a glass substrate with a thickness of not more than 200 μm, which is satisfied with the quality required for a substrate on which a thin-film electric circuit is formed, and a sheet glass substrate obtained according to this method. The present invention is concerned with a method for producing a glass substrate having a sheet thickness of from 10 to 200 μm, including a forming step of forming a molten glass into a ribbon shape in accordance with a down draw method, an annealing step of annealing the glass ribbon, and a cutting step of cutting the glass ribbon to give a glass substrate, wherein an average cooling rate in a temperature range of from the (annealing point+200° C.) to the (annealing point+50° C.) is controlled to the range of from 300 to 2,500° C./min. |
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AbstractList | The present invention is aimed to provide a method for producing a glass substrate with a thickness of not more than 200 μm, which is satisfied with the quality required for a substrate on which a thin-film electric circuit is formed, and a sheet glass substrate obtained according to this method. The present invention is concerned with a method for producing a glass substrate having a sheet thickness of from 10 to 200 μm, including a forming step of forming a molten glass into a ribbon shape in accordance with a down draw method, an annealing step of annealing the glass ribbon, and a cutting step of cutting the glass ribbon to give a glass substrate, wherein an average cooling rate in a temperature range of from the (annealing point+200° C.) to the (annealing point+50° C.) is controlled to the range of from 300 to 2,500° C./min. |
Author | AIBA HISATOSHI FUJIWARA KATSUTOSHI KATO YOSHINARI KAWAGUCHI TAKAHIRO |
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RelatedCompanies | NIPPON ELECTRIC GLASS CO., LTD AIBA HISATOSHI FUJIWARA KATSUTOSHI KATO YOSHINARI KAWAGUCHI TAKAHIRO |
RelatedCompanies_xml | – name: KATO YOSHINARI – name: NIPPON ELECTRIC GLASS CO., LTD – name: KAWAGUCHI TAKAHIRO – name: AIBA HISATOSHI – name: FUJIWARA KATSUTOSHI |
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Snippet | The present invention is aimed to provide a method for producing a glass substrate with a thickness of not more than 200 μm, which is satisfied with the... |
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SubjectTerms | CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS |
Title | Method for producing glass substrate and glass substrate |
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