Method for producing glass substrate and glass substrate

The present invention is aimed to provide a method for producing a glass substrate with a thickness of not more than 200 μm, which is satisfied with the quality required for a substrate on which a thin-film electric circuit is formed, and a sheet glass substrate obtained according to this method. Th...

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Main Authors AIBA HISATOSHI, KATO YOSHINARI, FUJIWARA KATSUTOSHI, KAWAGUCHI TAKAHIRO
Format Patent
LanguageEnglish
Published 01.12.2015
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Abstract The present invention is aimed to provide a method for producing a glass substrate with a thickness of not more than 200 μm, which is satisfied with the quality required for a substrate on which a thin-film electric circuit is formed, and a sheet glass substrate obtained according to this method. The present invention is concerned with a method for producing a glass substrate having a sheet thickness of from 10 to 200 μm, including a forming step of forming a molten glass into a ribbon shape in accordance with a down draw method, an annealing step of annealing the glass ribbon, and a cutting step of cutting the glass ribbon to give a glass substrate, wherein an average cooling rate in a temperature range of from the (annealing point+200° C.) to the (annealing point+50° C.) is controlled to the range of from 300 to 2,500° C./min.
AbstractList The present invention is aimed to provide a method for producing a glass substrate with a thickness of not more than 200 μm, which is satisfied with the quality required for a substrate on which a thin-film electric circuit is formed, and a sheet glass substrate obtained according to this method. The present invention is concerned with a method for producing a glass substrate having a sheet thickness of from 10 to 200 μm, including a forming step of forming a molten glass into a ribbon shape in accordance with a down draw method, an annealing step of annealing the glass ribbon, and a cutting step of cutting the glass ribbon to give a glass substrate, wherein an average cooling rate in a temperature range of from the (annealing point+200° C.) to the (annealing point+50° C.) is controlled to the range of from 300 to 2,500° C./min.
Author AIBA HISATOSHI
FUJIWARA KATSUTOSHI
KATO YOSHINARI
KAWAGUCHI TAKAHIRO
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RelatedCompanies NIPPON ELECTRIC GLASS CO., LTD
AIBA HISATOSHI
FUJIWARA KATSUTOSHI
KATO YOSHINARI
KAWAGUCHI TAKAHIRO
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Snippet The present invention is aimed to provide a method for producing a glass substrate with a thickness of not more than 200 μm, which is satisfied with the...
SourceID epo
SourceType Open Access Repository
SubjectTerms CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMISTRY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
GLASS
JOINING GLASS TO GLASS OR OTHER MATERIALS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METALLURGY
MINERAL OR SLAG WOOL
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Title Method for producing glass substrate and glass substrate
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