Sn-58Bi微焊点组织与力学性能的尺寸效应行为
TG425.1; 研究了回流焊点尺寸的减小对Sn-58Bi焊点显微组织形貌的影响,分析了在不同老化时间下焊点尺寸的减小对焊点界面微观组织的演变和剪切性能的影响.结果表明,在相同的冷却条件下,焊点尺寸的减小造成焊点在凝固阶段有较大的过冷度,在焊点内形成大块的初生β-Sn相,使得不同尺寸焊点内锡相和铋相的晶粒尺寸分布产生差异.Cu原子扩散速率的差异,Sn-58Bi焊点尺寸的减小有利于回流后界面金属化合物(IMC)的生长,并且在老化条件下,300 μm焊点界面IMC的生长速率为 0.324 μm/day1/2,大于 400 μm和 760 μm焊点界面IMC的生长速率,300 μm焊点界面IMC需要...
Saved in:
| Published in | 焊接学报 Vol. 44; no. 12; pp. 70 - 81 |
|---|---|
| Main Authors | , |
| Format | Journal Article |
| Language | Chinese |
| Published |
江苏科技大学,镇江, 212000
01.12.2023
|
| Subjects | |
| Online Access | Get full text |
| ISSN | 0253-360X |
| DOI | 10.12073/j.hjxb.20230613008 |
Cover
| Abstract | TG425.1; 研究了回流焊点尺寸的减小对Sn-58Bi焊点显微组织形貌的影响,分析了在不同老化时间下焊点尺寸的减小对焊点界面微观组织的演变和剪切性能的影响.结果表明,在相同的冷却条件下,焊点尺寸的减小造成焊点在凝固阶段有较大的过冷度,在焊点内形成大块的初生β-Sn相,使得不同尺寸焊点内锡相和铋相的晶粒尺寸分布产生差异.Cu原子扩散速率的差异,Sn-58Bi焊点尺寸的减小有利于回流后界面金属化合物(IMC)的生长,并且在老化条件下,300 μm焊点界面IMC的生长速率为 0.324 μm/day1/2,大于 400 μm和 760 μm焊点界面IMC的生长速率,300 μm焊点界面IMC需要更短的时间从扇贝状成长为平板状.300 μm焊点中有更强的机械约束效应,导致300 μm焊点具有更高的抗剪切强度,回流后抗剪切强度达到了 70.89 MPa,400 μm和 760 μm焊点抗剪切强度分别为67.19 MPa和60.97 MPa. |
|---|---|
| AbstractList | TG425.1; 研究了回流焊点尺寸的减小对Sn-58Bi焊点显微组织形貌的影响,分析了在不同老化时间下焊点尺寸的减小对焊点界面微观组织的演变和剪切性能的影响.结果表明,在相同的冷却条件下,焊点尺寸的减小造成焊点在凝固阶段有较大的过冷度,在焊点内形成大块的初生β-Sn相,使得不同尺寸焊点内锡相和铋相的晶粒尺寸分布产生差异.Cu原子扩散速率的差异,Sn-58Bi焊点尺寸的减小有利于回流后界面金属化合物(IMC)的生长,并且在老化条件下,300 μm焊点界面IMC的生长速率为 0.324 μm/day1/2,大于 400 μm和 760 μm焊点界面IMC的生长速率,300 μm焊点界面IMC需要更短的时间从扇贝状成长为平板状.300 μm焊点中有更强的机械约束效应,导致300 μm焊点具有更高的抗剪切强度,回流后抗剪切强度达到了 70.89 MPa,400 μm和 760 μm焊点抗剪切强度分别为67.19 MPa和60.97 MPa. |
| Abstract_FL | The effect of reducing the size of reflow solder joints on the microstructure and morphology of Sn-58Bi solder joints was studied.The effect of reducing the size of solder joints at different aging times on the evolution of interfacial mi-crostructure and shear properties of solder joints was also ana-lyzed.The results showed that under the same cooling condi-tion,the reduction of solder joint size resulted in a greater un-dercooling of solder joints during the solidification stage,the growth of β-Sn primary phases,and the differences in the grain size distribution of Sn and Bi phases within the solder joints.Due to the differences in the diffusion rates of Cu atoms,the reduction in the size of Sn-58Bi solder joint was beneficial to the growth of interfacial metallic compounds(IMCs)after re-flowing.Meanwhile,under aging condition,the interfacial growth rate of IMC at the solder joint with size of 300 μm was greater than that with size of 400 μm and 760 μm.At the inter-face of solder joints,the joints with size of 300 μm needed a shorter time to grow from a scallop shape to a flatten shape.Due to constrain effect,the joint with size of 300 μm presented a higher shear strength compared with the joints with size of 400 μm and 760 μm. |
| Author | 王小伟 王凤江 |
| AuthorAffiliation | 江苏科技大学,镇江, 212000 |
| AuthorAffiliation_xml | – name: 江苏科技大学,镇江, 212000 |
| Author_FL | WANG Xiao-wei WANG Fengjiang |
| Author_FL_xml | – sequence: 1 fullname: WANG Xiao-wei – sequence: 2 fullname: WANG Fengjiang |
| Author_xml | – sequence: 1 fullname: 王小伟 – sequence: 2 fullname: 王凤江 |
| BookMark | eNotzz1Lw0AcBvAbKlhrP4GzY-L_f5e7S9y0-AYFBxXcSi650wa5gkF0FC1YijjpopOLTr6MMUU_TdP0Y5ii0zM88Dz8FkjN9qwmZAnBRQqSrSTucXKhXAqUgUAG4NdIHShnDhNwOE-aadpVVYlCok_rZHXPOtxf7xY_72V_WF59laN-OboZZ3fF8Kl4e5lcvk6vv8vHfvGZFx_Z5GFQ5PfT59txli-SOROepLr5nw1ysLmx39p22rtbO621tpMiADpR5MUxj9GA5MgpRszTXHpUe5IblJFPWRhqFWgBBoQJlNBGBehpBczEAbAGWf7bPQ-tCe1RJ-mdndrqsTOjzqQVHZH9Arf7XNs |
| ClassificationCodes | TG425.1 |
| ContentType | Journal Article |
| Copyright | Copyright © Wanfang Data Co. Ltd. All Rights Reserved. |
| Copyright_xml | – notice: Copyright © Wanfang Data Co. Ltd. All Rights Reserved. |
| DBID | 2B. 4A8 92I 93N PSX TCJ |
| DOI | 10.12073/j.hjxb.20230613008 |
| DatabaseName | Wanfang Data Journals - Hong Kong WANFANG Data Centre Wanfang Data Journals 万方数据期刊 - 香港版 China Online Journals (COJ) China Online Journals (COJ) |
| DatabaseTitleList | |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering |
| DocumentTitle_FL | Size effect behavior of microstructure and mechanical properties in Sn-58Bi micro solder joints |
| EndPage | 81 |
| ExternalDocumentID | hjxb202312011 |
| GroupedDBID | -02 2B. 4A8 5XA 5XC 92H 92I 93N ABJNI ACGFS ALMA_UNASSIGNED_HOLDINGS CCEZO CDRFL CW9 GROUPED_DOAJ PSX TCJ TGT U1G U5L |
| ID | FETCH-LOGICAL-s1001-cc4dd5d1f0751521c34e5742e475f17c823aaeb9e60f06f9b6efb914eb03fd903 |
| ISSN | 0253-360X |
| IngestDate | Thu May 29 04:08:03 EDT 2025 |
| IsPeerReviewed | true |
| IsScholarly | true |
| Issue | 12 |
| Keywords | 尺寸效应 thermal aging 热老化 size effect Sn-58Bi焊点 Sn-58Bi solder joint |
| Language | Chinese |
| LinkModel | OpenURL |
| MergedId | FETCHMERGED-LOGICAL-s1001-cc4dd5d1f0751521c34e5742e475f17c823aaeb9e60f06f9b6efb914eb03fd903 |
| PageCount | 12 |
| ParticipantIDs | wanfang_journals_hjxb202312011 |
| PublicationCentury | 2000 |
| PublicationDate | 2023-12-01 |
| PublicationDateYYYYMMDD | 2023-12-01 |
| PublicationDate_xml | – month: 12 year: 2023 text: 2023-12-01 day: 01 |
| PublicationDecade | 2020 |
| PublicationTitle | 焊接学报 |
| PublicationTitle_FL | Transactions of the China Welding Institution |
| PublicationYear | 2023 |
| Publisher | 江苏科技大学,镇江, 212000 |
| Publisher_xml | – name: 江苏科技大学,镇江, 212000 |
| SSID | ssib023167182 ssib002263800 ssib051374092 ssib001105240 ssj0050129 |
| Score | 2.4065554 |
| Snippet | TG425.1;... |
| SourceID | wanfang |
| SourceType | Aggregation Database |
| StartPage | 70 |
| Title | Sn-58Bi微焊点组织与力学性能的尺寸效应行为 |
| URI | https://d.wanfangdata.com.cn/periodical/hjxb202312011 |
| Volume | 44 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV07bxQxELaO0ECBeIpnlAKXG3a9XttLZ1_2FCFBQyJdF-2TQHGRyEVCqRCcBIoQFTRQ0UDFowwXwa_J5dLwH5jx-e42cBKPZmV5x-OZHd_4s88zJuS6KDiXpeBewaLC46xUXqpy5fG0wLBLwVMb4X37jlhe5bfaUbvR-FE7tbTVzRbz7ZlxJf9jVagDu2KU7D9YdsIUKqAM9oUnWBief2Xjux0vUuY-TSJqEqoTmkiqABxqW2DUxFgwBitdQdKEU6OoSrAVUMYGC3qJakETgQcfNNAAQUjNEraKtW0OXfjUaEvcQg5AHAMHZV8BH46tdEBV03XhtgAc8q3JJrB3HR3tV0PN2PqWNqHKuG5Vy7Js0rg1kwS00hy5mGBM4jYyWPjLoZAJldXRWNYSVY4DJwZ8ARSM2-8wlpCBUrHVV045wOiEKdn3_Zo3ZVHohcJv113_KPXkeIizmiMf3WYyhgTBzMmGgXu0s836g0fZIrOrOfx3UE3n1smJRyRBigAB1zFynEmAerUdAIteAesyXg9LBuc4zZ7IMGlBME1FFAWh5DZl1gh4RLinaLcUnaYuyRaKeeN3IW2UWqdKO_dqgGrlNDnlVkILejSsz5DG9vpZcrKWH_McuekG-OD7p2FvZ_jk63CvN9x7tr_7crDzdvDx_cHjD4dPvw3f9AZf-oPPuwevnw_6rw7fvdjf7Z8nq61kpbnsucs-vE1MA-blOS-KqAgqwLCIKfOQl5EE58FlVAUyVyxM0zKLS-FXvqjiTJRVFge8zPywKmI_vEDmOhud8iJZUHnKsoIXUiq8YK_Kcu7zClZCRVhJkalLZN5pvuZ-zJtrR-xz-U8EV8iJ6Qi-Sua6D7fKawBOu9m8NelPhRhrkg |
| linkProvider | Directory of Open Access Journals |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Sn-58Bi%E5%BE%AE%E7%84%8A%E7%82%B9%E7%BB%84%E7%BB%87%E4%B8%8E%E5%8A%9B%E5%AD%A6%E6%80%A7%E8%83%BD%E7%9A%84%E5%B0%BA%E5%AF%B8%E6%95%88%E5%BA%94%E8%A1%8C%E4%B8%BA&rft.jtitle=%E7%84%8A%E6%8E%A5%E5%AD%A6%E6%8A%A5&rft.au=%E7%8E%8B%E5%B0%8F%E4%BC%9F&rft.au=%E7%8E%8B%E5%87%A4%E6%B1%9F&rft.date=2023-12-01&rft.pub=%E6%B1%9F%E8%8B%8F%E7%A7%91%E6%8A%80%E5%A4%A7%E5%AD%A6%2C%E9%95%87%E6%B1%9F%2C+212000&rft.issn=0253-360X&rft.volume=44&rft.issue=12&rft.spage=70&rft.epage=81&rft_id=info:doi/10.12073%2Fj.hjxb.20230613008&rft.externalDocID=hjxb202312011 |
| thumbnail_s | http://utb.summon.serialssolutions.com/2.0.0/image/custom?url=http%3A%2F%2Fwww.wanfangdata.com.cn%2Fimages%2FPeriodicalImages%2Fhjxb%2Fhjxb.jpg |