VCrAl1.21Ni0.93Co1.85高熵合金中间层真空扩散连接TC4钛合金和T2铜

TG453; 根据伪二元合金设计策略和共晶高熵合金设计理念,设计并制备了 VCrAl1.21Ni0.93Co1.85共晶高熵合金中间层用于真空扩散连接TC4钛合金和T2铜,研究了不同连接温度对TC4/T2扩散连接接头微观组织和力学性能的影响规律.结果表明,所有接头界面结合良好无缺陷产生,在TC4侧的连接界面附近发生了部分相变,由a-Ti向β-Ti进行转变,并且形成了部分魏氏体组织.Ti2(Co,Ni),Ti2(V,Cr,Al),Ti(V,Cr,Co)和(V,Cr)(Al,Ni,Co)相形成在 TC4/VCrAl1.21Ni0.93Co1.85 界面上,而VCrAl1.21Ni0.93Co1.8...

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Published in焊接学报 Vol. 45; no. 9; pp. 1 - 13
Main Authors 吴宝生, 李鹏, 马月婷, 董红刚
Format Journal Article
LanguageChinese
Published 大连理工大学,材料科学与工程学院,大连,116024 01.09.2024
Subjects
TC4 titanium alloy/T2 copper dissimilar metal
micro-structure
真空扩散连接
shear strength
VCrAl1.21Ni0.93Co1.85中间层
微观组织
VCrAl1.21Ni0.93Co1.85 interlayer
TC4钛合金/T2铜异种金属
抗剪强度
vacuum diffusion bonding
Online AccessGet full text
ISSN0253-360X
DOI10.12073/j.hjxb.20230905001

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Abstract TG453; 根据伪二元合金设计策略和共晶高熵合金设计理念,设计并制备了 VCrAl1.21Ni0.93Co1.85共晶高熵合金中间层用于真空扩散连接TC4钛合金和T2铜,研究了不同连接温度对TC4/T2扩散连接接头微观组织和力学性能的影响规律.结果表明,所有接头界面结合良好无缺陷产生,在TC4侧的连接界面附近发生了部分相变,由a-Ti向β-Ti进行转变,并且形成了部分魏氏体组织.Ti2(Co,Ni),Ti2(V,Cr,Al),Ti(V,Cr,Co)和(V,Cr)(Al,Ni,Co)相形成在 TC4/VCrAl1.21Ni0.93Co1.85 界面上,而VCrAl1.21Ni0.93Co1.85/T2界面上形成了(V,Cr)(Al,Ni,Co)和(V,Cr)(Cu,Ni,Co)3相.界面上形成高熵微观组织结构起到高熵固溶强化作用,扩散层Ⅰ和Ⅱ对应的生长激活能分别为229 kJ/mol和191 kJ/mol,接头抗剪强度在880 ℃时达到最大为194 MPa,接头主要沿着BCC基体相和B2相交替位置断裂,断口表面出现河流花样特征,属于一种典型的解理断裂模式.
AbstractList TG453; 根据伪二元合金设计策略和共晶高熵合金设计理念,设计并制备了 VCrAl1.21Ni0.93Co1.85共晶高熵合金中间层用于真空扩散连接TC4钛合金和T2铜,研究了不同连接温度对TC4/T2扩散连接接头微观组织和力学性能的影响规律.结果表明,所有接头界面结合良好无缺陷产生,在TC4侧的连接界面附近发生了部分相变,由a-Ti向β-Ti进行转变,并且形成了部分魏氏体组织.Ti2(Co,Ni),Ti2(V,Cr,Al),Ti(V,Cr,Co)和(V,Cr)(Al,Ni,Co)相形成在 TC4/VCrAl1.21Ni0.93Co1.85 界面上,而VCrAl1.21Ni0.93Co1.85/T2界面上形成了(V,Cr)(Al,Ni,Co)和(V,Cr)(Cu,Ni,Co)3相.界面上形成高熵微观组织结构起到高熵固溶强化作用,扩散层Ⅰ和Ⅱ对应的生长激活能分别为229 kJ/mol和191 kJ/mol,接头抗剪强度在880 ℃时达到最大为194 MPa,接头主要沿着BCC基体相和B2相交替位置断裂,断口表面出现河流花样特征,属于一种典型的解理断裂模式.
Abstract_FL VCrAl1.21Ni0.93Co1.85 eutectic high entropy alloy interlayer was designed based on the pseudo-binary strategy and design concept of eutectic high entropy alloy,which was used to join TC4 titanium alloy and T2 copper via vacuum diffusion bonding.The influence of bonding temperature on the microstructure and mechanical property of TC4/T2 diffusion bonded joint was investigated.The results showed that all the joint were well combined without defects.TC4 titanium alloy adjacent to the diffusion layer underwent a phase transition from α-Ti to β-Ti,forming part of the Widmanstatten structure.Ti2(Co,Ni),Ti2(V,Cr,Al),Ti(V,Cr,Co)and(V,Cr)(Al,Ni,Co)phases appeared in the TC4/VCrAl1.21Ni0.93Co1.85 interface while(V,Cr)(Al,Ni,Co)and(V,Cr)(Cu,Ni,Co)3 phases formed in the VCrAl1.21Ni0.93Co1.85/T2 interface.The high entropy microstructure formed in the interface,which played the role of high entropy solution strengthening.The growth activation energy of diffusion layer Ⅰ and Ⅱ was 229 kJ/mol and 191 kJ/mol,respectively.The maximum shear strength of joint at 880 ℃ reached 194 MPa.The joint fracture was mainly along the BCC matrix phase and B2 phase alternately,and the fracture surface had the feature of river pattern,which belonged to a typical cleavage fracture mode.
Author 吴宝生
马月婷
董红刚
李鹏
AuthorAffiliation 大连理工大学,材料科学与工程学院,大连,116024
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DONG Honggang
LI Peng
MA Yueting
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  fullname: 李鹏
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DocumentTitle_FL Vacuum diffusion bonding of TC4 titanium alloy to T2 copper with VCrAl1.21Ni0.93Co1.85 high entropy alloy interlayer
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Keywords TC4 titanium alloy/T2 copper dissimilar metal
micro-structure
真空扩散连接
shear strength
VCrAl1.21Ni0.93Co1.85中间层
微观组织
VCrAl1.21Ni0.93Co1.85 interlayer
TC4钛合金/T2铜异种金属
抗剪强度
vacuum diffusion bonding
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PublicationTitle 焊接学报
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Title VCrAl1.21Ni0.93Co1.85高熵合金中间层真空扩散连接TC4钛合金和T2铜
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