APA (7th ed.) Citation

Cho(조순덕), S., Lee(이승구), S. K., & Kim(김건희), G. (2008). Quality Maintenance of Oak Mushroom during Modified Atmosphere Storage as Affected by Packaging Materials under Various Temperatures. Weon'ye gwahag gi'sulji, 26(4), 393-399.

Chicago Style (17th ed.) Citation

Cho(조순덕), Sun-Duk, Seung Koo Lee(이승구), and Gun-Hee Kim(김건희). "Quality Maintenance of Oak Mushroom During Modified Atmosphere Storage as Affected by Packaging Materials Under Various Temperatures." Weon'ye Gwahag Gi'sulji 26, no. 4 (2008): 393-399.

MLA (9th ed.) Citation

Cho(조순덕), Sun-Duk, et al. "Quality Maintenance of Oak Mushroom During Modified Atmosphere Storage as Affected by Packaging Materials Under Various Temperatures." Weon'ye Gwahag Gi'sulji, vol. 26, no. 4, 2008, pp. 393-399.