LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 리플로우 횟수의 영향
The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads ar...
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| Published in | 대한금속·재료학회지, 48(11) Vol. 48; no. 11; pp. 1035 - 1040 |
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| Main Authors | , , , , , , , , , , , |
| Format | Journal Article |
| Language | Korean |
| Published |
대한금속재료학회
20.11.2010
대한금속·재료학회 |
| Subjects | |
| Online Access | Get full text |
| ISSN | 1738-8228 2288-8241 |
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| Abstract | The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A Cu6Sn5 intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows. |
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| AbstractList | The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A Cu6Sn5 intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows. The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study,Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A Cu6Sn5 intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows. KCI Citation Count: 20 |
| Author | 안지혁 고민관 이영철 Ji Hyuk Ahn Jeong won Yoon Young Chul Lee Kwang Seok Kim 윤정원 정승부 Seung Boo Jung Min Kwan Ko 김광석 |
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| BackLink | https://www.kci.go.kr/kciportal/ci/sereArticleSearch/ciSereArtiView.kci?sereArticleSearchBean.artiId=ART001500527$$DAccess content in National Research Foundation of Korea (NRF) |
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| DocumentTitleAlternate | LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 리플로우 횟수의 영향 Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package |
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| Notes | The Korean Institute of Metals and Materials G704-000085.2010.48.11.001 |
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| PublicationTitle | 대한금속·재료학회지, 48(11) |
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| Snippet | The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount... |
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| SubjectTerms | bonding intermetallics LED package mechanical properties shear test 재료공학 |
| Title | LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 리플로우 횟수의 영향 |
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