Cu 필라 솔더 범프의 리플로우 전후 형상변화 및 모델링
A Cu pillar bump was fabricated by consecutive plating of Cu and Sn. Here, we investigated the change in shape of Sn, and the formation of intermetallic compound during the reflow process. At first, we made a cylindrical shape of Sn in various thickness and then, the Sn was changed into a truncated...
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| Published in | 대한금속·재료학회지, 53(7) Vol. 53; no. 7; pp. 495 - 499 |
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| Main Authors | , , , , , , , , , , , , , |
| Format | Journal Article |
| Language | Korean |
| Published |
대한금속재료학회
31.07.2015
대한금속·재료학회 |
| Subjects | |
| Online Access | Get full text |
| ISSN | 1738-8228 2288-8241 |
| DOI | 10.3365/KJMM.2015.53.7.495 |
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| Abstract | A Cu pillar bump was fabricated by consecutive plating of Cu and Sn. Here, we investigated the change in shape of Sn, and the formation of intermetallic compound during the reflow process. At first, we made a cylindrical shape of Sn in various thickness and then, the Sn was changed into a truncated sphere (Sn bump) on a Cu pillar through the reflow process. When the Sn thickness was a third of the Cu pillar diameter, the reflowed bump radius had a minimum value and the bump-height change at that time had a maximum value. Such results were well understood based on the truncated sphere model. |
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| AbstractList | A Cu pillar bump was fabricated by consecutive plating of Cu and Sn. Here, we investigated the change in shape of Sn, and the formation of intermetallic compound during the reflow process. At first, we made a cylindrical shape of Sn in various thickness and then, the Sn was changed into a truncated sphere (Sn bump) on a Cu pillar through the reflow process. When the Sn thickness was a third of the Cu pillar diameter, the reflowed bump radius had a minimum value and the bump-height change at that time had a maximum value. Such results were well understood based on the truncated sphere model. A Cu pillar bump was fabricated by consecutive plating of Cu and Sn. Here, we investigated the change in shape of Sn, and the formation of intermetallic compound during the reflow process. At first, we made a cylindrical shape of Sn in various thickness and then, the Sn was changed into a truncated sphere (Sn bump) on a Cu pillar through the reflow process. When the Sn thickness was a third of the Cu pillar diameter, the reflowed bump radius had a minimum value and the bump-height change at that time had a maximum value. Such results were well understood based on the truncated sphere model. KCI Citation Count: 12 |
| Author | Hyo Jong Lee Sang Hyuk Kim Chae Min Park 차필령 김상혁 Han Kyun Shin Ui Hyoung Lee Pil Ryung Cha 신한균 이의형 박채민 이효종 김동욱 Dong Uk Kim |
| Author_xml | – sequence: 1 fullname: 김상혁 – sequence: 2 fullname: Sang Hyuk Kim – sequence: 3 fullname: 신한균 – sequence: 4 fullname: Han Kyun Shin – sequence: 5 fullname: 박채민 – sequence: 6 fullname: Chae Min Park – sequence: 7 fullname: 김동욱 – sequence: 8 fullname: Dong Uk Kim – sequence: 9 fullname: 차필령 – sequence: 10 fullname: Pil Ryung Cha – sequence: 11 fullname: 이의형 – sequence: 12 fullname: Ui Hyoung Lee – sequence: 13 fullname: 이효종 – sequence: 14 fullname: Hyo Jong Lee |
| BackLink | https://www.kci.go.kr/kciportal/ci/sereArticleSearch/ciSereArtiView.kci?sereArticleSearchBean.artiId=ART002011657$$DAccess content in National Research Foundation of Korea (NRF) |
| BookMark | eNotjz1Lw0AAhg9RsNb-AV0yuiTeR653N5biR7VFkDqHfNxJiLaS6OBmMThZXFKoHwVdVMSh6OLgP7rkPxit7_K8w8ML7xKY7_V7EoAVBC1C6nR9d6fTsTBE1KLEYpYt6ByoYMy5ybGN5kEFMfLbMV8EtSQJPQgpEpRTuwJazTOjGKV68m3kV5keZob-yIoszSdjQz-_F9m1fnrI76ZG_pgW96lRjEf55UB_XhS3pTq9MfTbqx5-6ZfBMlhQ7lEia_-sgoPNjW5z22zvbbWajbYZIUxOTRoIIggMlCTcU56vXMQDygMmBBS-SwVmXFLuIeyLurKxsLHPJRNSMZfbUpIqWJvt9mLlRH7o9N3wj4d9J4qdxn635TCIy4ulujpTozBJnJM4PHbjc4eU4YiSH1cub6M |
| ContentType | Journal Article |
| DBID | HZB Q5X ACYCR |
| DOI | 10.3365/KJMM.2015.53.7.495 |
| DatabaseName | 한국학술정보 KISS Korean Studies Information Service System (KISS) B-Type Korean Citation Index |
| DatabaseTitleList | |
| DeliveryMethod | fulltext_linktorsrc |
| DocumentTitleAlternate | Cu 필라 솔더 범프의 리플로우 전후 형상변화 및 모델링 Shape Change of Cu Pillar Solder Bump During Reflow Process and Its Modeling |
| EISSN | 2288-8241 |
| EndPage | 499 |
| ExternalDocumentID | oai_kci_go_kr_ARTI_702051 3333815 |
| GroupedDBID | ALMA_UNASSIGNED_HOLDINGS HZB M~E Q5X ACYCR |
| ID | FETCH-LOGICAL-k123t-5d93930dfe38bfbcfa18d58d79909ca59278e58b12c96f42942c8e79ef7a84ee3 |
| ISSN | 1738-8228 |
| IngestDate | Tue Nov 21 21:41:07 EST 2023 Wed Oct 29 02:34:14 EDT 2025 |
| IsPeerReviewed | true |
| IsScholarly | true |
| Issue | 7 |
| Language | Korean |
| LinkModel | OpenURL |
| MergedId | FETCHMERGED-LOGICAL-k123t-5d93930dfe38bfbcfa18d58d79909ca59278e58b12c96f42942c8e79ef7a84ee3 |
| Notes | The Korean Institute of Metals and Materials G704-000085.2015.53.7.002 |
| PageCount | 5 |
| ParticipantIDs | nrf_kci_oai_kci_go_kr_ARTI_702051 kiss_primary_3333815 |
| PublicationCentury | 2000 |
| PublicationDate | 20150731 |
| PublicationDateYYYYMMDD | 2015-07-31 |
| PublicationDate_xml | – month: 07 year: 2015 text: 20150731 day: 31 |
| PublicationDecade | 2010 |
| PublicationTitle | 대한금속·재료학회지, 53(7) |
| PublicationTitleAlternate | 대한금속재료학회지 |
| PublicationYear | 2015 |
| Publisher | 대한금속재료학회 대한금속·재료학회 |
| Publisher_xml | – name: 대한금속재료학회 – name: 대한금속·재료학회 |
| SSID | ssib005195854 ssib006262540 ssib044734076 ssib023167440 ssib036264765 ssib001148846 ssib002806993 ssib014806100 |
| Score | 2.0170252 |
| Snippet | A Cu pillar bump was fabricated by consecutive plating of Cu and Sn. Here, we investigated the change in shape of Sn, and the formation of intermetallic... |
| SourceID | nrf kiss |
| SourceType | Open Website Publisher |
| StartPage | 495 |
| SubjectTerms | EBSD electron backscattering diffraction electroplating soldering wetting 재료공학 |
| Title | Cu 필라 솔더 범프의 리플로우 전후 형상변화 및 모델링 |
| URI | https://kiss.kstudy.com/ExternalLink/Ar?key=3333815 https://www.kci.go.kr/kciportal/ci/sereArticleSearch/ciSereArtiView.kci?sereArticleSearchBean.artiId=ART002011657 |
| Volume | 53 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| ispartofPNX | 대한금속·재료학회지, 2015, 53(7), 504, pp.495-499 |
| journalDatabaseRights | – providerCode: PRVHPJ databaseName: ROAD: Directory of Open Access Scholarly Resources customDbUrl: eissn: 2288-8241 dateEnd: 99991231 omitProxy: true ssIdentifier: ssib044734076 issn: 1738-8228 databaseCode: M~E dateStart: 20070101 isFulltext: true titleUrlDefault: https://road.issn.org providerName: ISSN International Centre |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwrR1Nb9MwNBrjwgWBBmJ8KUj4VLU0sR3bxzTr1LUqFzZptyhJkzFVa1FpDuOAmKg4MXHppPExCS6AEIcJLhz4R2n-A89O2nRjB0D0kDrPz8_v5Tn2e3b8rGl3WUCpH5kGuCWGVyamQaAfJAxcFcsjImARq8rNye37VmODNDfp5sK55txXS_HQrwRPztxX8i9aBRjoVe6S_QvNzogCANKgX7iChuH6Rzp24hKqryBBESeoXkNiBdUcADmIW0goEIdsUpKpmqlA8l6hOxJdcJVnW8h2pnmOghhIOArJRrWqomlXVTlAArIkq5nLymV9GExSVQuW307ILDGrGMqtZtXYyOY5VzWVsBnKzlKZGsgq15nSoIoJWyJznssFZSVbdcUxUMCK4wxZqIStII4iPluNUWSEIjxjVwnAZ43ugdfbKjV2426ptb1TlAP0mhT-BEMMIEXv3Su1dmPoKB_mcczzaRSDTudn84b_v6SbG0oYDCVgfvH5sSYLjJy_U2xu4CDZUaOnBzSMLRn7o9Vst-VniLRCcYVVcuRTgcIx_LiMt3DehBFOHmPSflovTGPwezk5uaIuTvTNgvI50xIcXZMWcYCgNFh-RShHU0ZQIEW-jGpEWLFiTgjDpKrOdpw9iGzPmhTp3u8CgUkEHtNjMPF6g2jOxFu_pF3MfTPdzl60y9pCt7-krTmxnh6MkqOf-uTFONkf68m3cToeTY4O9eTj13T8MvnwbvLmWJ-8H6VvR3p6eDB5vpd8f5a-BtTjV3ry5XOy_yP5tHdF21itrzuNcn7-SLkL9tywTDsCC1ztRCHmfuQHkWfwDuUdBhacCDwqTMZDyn3DDIQVgWFHzICHTIQR8zgJQ3xVW-z1e-E1TRfYMwn1A4otDg6KwcPA41FAQ65mNKJlbUlK7z7KQsy4uS6XtTvwNNxusO3KMPDyf6vvdgcuOLtrLgNXjxrXzy56Q7tQNPOb2uJwEIe3wH4e-rdVw_gFBi2T2Q |
| linkProvider | ISSN International Centre |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Cu+%ED%95%84%EB%9D%BC+%EC%86%94%EB%8D%94+%EB%B2%94%ED%94%84%EC%9D%98+%EB%A6%AC%ED%94%8C%EB%A1%9C%EC%9A%B0+%EC%A0%84%ED%9B%84+%ED%98%95%EC%83%81%EB%B3%80%ED%99%94+%EB%B0%8F+%EB%AA%A8%EB%8D%B8%EB%A7%81&rft.jtitle=%EB%8C%80%ED%95%9C%EA%B8%88%EC%86%8D%EC%9E%AC%EB%A3%8C%ED%95%99%ED%9A%8C%EC%A7%80&rft.au=%EA%B9%80%EC%83%81%ED%98%81&rft.au=Sang+Hyuk+Kim&rft.au=%EC%8B%A0%ED%95%9C%EA%B7%A0&rft.au=Han+Kyun+Shin&rft.date=2015-07-31&rft.pub=%EB%8C%80%ED%95%9C%EA%B8%88%EC%86%8D%EC%9E%AC%EB%A3%8C%ED%95%99%ED%9A%8C&rft.issn=1738-8228&rft.volume=53&rft.issue=7&rft.spage=495&rft_id=info:doi/10.3365%2FKJMM.2015.53.7.495&rft.externalDocID=3333815 |
| thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1738-8228&client=summon |
| thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1738-8228&client=summon |
| thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1738-8228&client=summon |